Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

Abstract: A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional groups per molecule; (b) a crosslinking agent having per molecule two or more crosslinkable groups having reactivity with the curable functional groups of the component (a); (c) a curing catalyst capable of catalyzing a crosslinking reaction of the component (a) and the component (b); (d) a pigment which itself does not emit a fluorescent light; and (e) a UV tracer. The composition can be used as an adhesive.

Abstract: A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) surface-treated silica.

Abstract: A curable composition includes a perfluoro(poly)ether group-containing silane compound represented by the general formula (I) (wherein, definitions of each group are as described in the specification); (b) an organic silicon compound having at least two OR2 groups bonded to Si atom (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.

Abstract: A curable composition includes: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and hydrolyzable groups; (B) a compound having at least two OR2 groups (in the formula, R2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being a group other than that selected from the group consisting of an —O— group and a group having a siloxane bond.

Abstract: A moisture-curable curable composition includes a perfluoro(poly)ether group-containing silane compound (a1) represented by formula (I); a perfluoro(poly)ether group-containing silane compound (a2) represented by formula (II) (in each formula, the definition of each group is as defined in the specification); (b) an organic silicon compound having at least two OR2 groups (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) bonded to Si atom or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.

Abstract: A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) an inorganic filler with a primary particle size from 0.01 to 0.1 ?m.

Abstract: A two-part RTV silicone is shown and described herein. In one aspect, provided is an electrostatically dissipative, two-part RTV silicone material. In embodiments, the silicone is white and exhibits a low thermal conductivity.

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Abstract: There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4?(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.