Patents by Inventor Isao Inoue

Isao Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939658
    Abstract: A deposition mask according to an embodiment of the present disclosure includes a first surface, a second surface that is located opposite the first surface, and two or more through-holes. Each of the through-holes includes a first recess that is located at the first surface and a second recess that is located at the second surface. The deposition mask has a first mask region having a first surface remaining ratio that represents a remaining area ratio of the second surface and a second mask region having a second surface remaining ratio that represents a remaining area ratio of the second surface and that is higher than the first surface remaining ratio.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 26, 2024
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Isao Miyatani, Chikao Ikenaga, Yoko Nakamura, Isao Inoue
  • Patent number: 11788181
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: October 17, 2023
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
  • Patent number: 11793014
    Abstract: A manufacturing method for an electronic device includes a preparation step of preparing a layered body including a substrate, two or more first electrodes, and organic layers, the substrate having a first surface and a second surface that is positioned opposite to the first surface, the two or more first electrodes positioned above the first surface of the substrate, the organic layers positioned above the first electrodes; a second electrode formation step of forming a second electrode above the organic layers so that the second electrode overlaps the two or more first electrodes when viewed in a normal direction to the first surface of the substrate; and a removal step of partly removing regions of the second electrode that is positioned between the first electrodes in plan view.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: October 17, 2023
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Isao Inoue, Yoko Nakamura
  • Publication number: 20230272517
    Abstract: A deposition mask includes a metal plate including first and second surfaces located opposite each other, through holes bored through the metal plate from the first surface to the second surface, and a flat region located between two through holes adjacent to each other in a case where the deposition mask is seen from the second surface side. The through holes are arrayed in a staggered arrangement in first and second directions in planar view. The flat region includes first and second flat regions located at first and second sides, respectively, of a first center line. The first center line passes through center points of two through holes adjacent to each other in the first direction. The first and second flat regions include portions in which dimensions of the first and second flat regions in the first direction increase away from the first center line, respectively.
    Type: Application
    Filed: February 3, 2023
    Publication date: August 31, 2023
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yuji ANZAI, Chikao IKENAGA, Isao INOUE
  • Publication number: 20230167539
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Application
    Filed: January 31, 2023
    Publication date: June 1, 2023
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo AOKI, Chikao IKENAGA, Isao INOUE
  • Patent number: 11608554
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Grant
    Filed: February 2, 2022
    Date of Patent: March 21, 2023
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
  • Publication number: 20220406853
    Abstract: An organic device may include a substrate, first electrodes located on top of the substrate, organic layers located on top of the first electrodes, and a second electrode located on top of the organic layers. When seen along a direction normal to the substrate, the organic device may include a display area including a first display area and a second display area. The first display area may include the organic layers distributed at a first density. The second display area may include the organic layers distributed at a second density that is lower than the first density. The second electrode may include a wide-area electrode spreading in a gapless manner in the first display area and two or more electrode lines overlapping the organic layers in the second display area. Each of the electrode lines includes an end connected to the wide-area electrode.
    Type: Application
    Filed: June 17, 2022
    Publication date: December 22, 2022
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Isao MIYATANI, Chikao IKENAGA, Yoko NAKAMURA, Isao INOUE
  • Publication number: 20220325397
    Abstract: A deposition mask according to an embodiment of the present disclosure includes a first surface, a second surface that is located opposite the first surface, and two or more through-holes. Each of the through-holes includes a first recess that is located at the first surface and a second recess that is located at the second surface. The deposition mask has a first mask region having a first surface remaining ratio that represents a remaining area ratio of the second surface and a second mask region having a second surface remaining ratio that represents a remaining area ratio of the second surface and that is higher than the first surface remaining ratio.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 13, 2022
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Isao MIYATANI, Chikao IKENAGA, Yoko NAKAMURA, Isao INOUE
  • Patent number: 11434559
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: September 6, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
  • Publication number: 20220209169
    Abstract: An organic device may include a substrate, first electrodes on the substrate, organic layers on the first electrodes, and a second electrode n the organic layers. When viewed in a direction normal to the substrate, the organic device may include a first display area that includes the second electrode at a first occupancy, and a second display area that includes the second electrode at a second occupancy lower than the first occupancy. In the second display area, the organic layers may be arranged in intersecting first and second directions, and the second electrode may include electrode lines arranged in the first direction. Each electrode line may include electrode sections arranged in the second direction and overlapping the organic layers. Any adjacent two electrode sections in the second direction may be connected. The electrode sections may include first and second electrode sections respectively having different first and second shapes.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 30, 2022
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoko NAKAMURA, Yasuyuki OYAGI, Yukio TANIGUCHI, Ryuji HORIGUCHI, Isao INOUE
  • Publication number: 20220209124
    Abstract: An organic device may include a substrate, first electrodes disposed on the substrate, organic layers respectively disposed on the first electrodes, and a second electrode disposed on the organic layers. When the organic device is viewed in a direction normal to the substrate, the organic device may include a first display area that includes the second electrode at a first occupancy, and a second display area that includes the second electrode at a second occupancy lower than the first occupancy. The second display area may include the second electrode, and transmission areas each surrounded by the second electrode in plan view. The transmission areas may include a first transmission area, and a second transmission area adjacent to the first transmission area via the second electrode. The first transmission area may have a first shape, and the second transmission area may have a second shape different from the first shape.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 30, 2022
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoko NAKAMURA, Yasuyuki OYAGI, Yukio TANIGUCHI, Ryuji HORIGUCHI, Isao INOUE
  • Publication number: 20220185238
    Abstract: A heating plate includes: a pair of glass plates; a conductive pattern disposed between the pair of glass plates and defining a plurality of opening areas; and a joint layer disposed between the conductive pattern and at least one of the pair of glass plates; wherein the conductive pattern includes a plurality of connection elements that extend between two branch points to define the opening areas; and a rate of the connection elements, which are straight line segments connecting the two branch points, relative to the plurality of connection elements, is less than 20%.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hirotoshi SUETSUGU, Manabu HIRAKAWA, Satoshi GOISHIHARA, Koichi KINOSHITA, Hidenori NAKAMURA, Koujiro OHKAWA, Tetsuo MATSUKURA, Isao INOUE
  • Publication number: 20220185237
    Abstract: A heating plate includes: a pair of glass plates; a conductive pattern disposed between the pair of glass plates and defining a plurality of opening areas; and a joint layer disposed between the conductive pattern and at least one of the pair of glass plates; wherein the conductive pattern includes a plurality of connection elements that extend between two branch points to define the opening areas; and a rate of the connection elements, which are straight line segments connecting the two branch points, relative to the plurality of connection elements, is less than 20%.
    Type: Application
    Filed: March 4, 2022
    Publication date: June 16, 2022
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hirotoshi SUETSUGU, Manabu HIRAKAWA, Satoshi GOISHIHARA, Koichi KINOSHITA, Hidenori NAKAMURA, Koujiro OHKAWA, Tetsuo MATSUKURA, Isao INOUE
  • Publication number: 20220162738
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Application
    Filed: February 2, 2022
    Publication date: May 26, 2022
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo AOKI, Chikao IKENAGA, Isao INOUE
  • Patent number: 11338774
    Abstract: A heating plate includes: a pair of glass plates; a conductive pattern disposed between the pair of glass plates and defining a plurality of opening areas; and a joint layer disposed between the conductive pattern and at least one of the pair of glass plates; wherein the conductive pattern includes a plurality of connection elements that extend between two branch points to define the opening areas; and a rate of the connection elements, which are straight line segments connecting the two branch points, relative to the plurality of connection elements, is less than 20%.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: May 24, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi Suetsugu, Manabu Hirakawa, Satoshi Goishihara, Koichi Kinoshita, Hidenori Nakamura, Koujiro Ohkawa, Tetsuo Matsukura, Isao Inoue
  • Patent number: 11299128
    Abstract: A heating plate includes: a pair of glass plates; a conductive pattern disposed between the pair of glass plates and defining a plurality of opening areas; and a joint layer disposed between the conductive pattern and at least one of the pair of glass plates; wherein the conductive pattern includes a plurality of connection elements that extend between two branch points to define the opening areas; and a rate of the connection elements, which are straight line segments connecting the two branch points, relative to the plurality of connection elements, is less than 20%.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: April 12, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi Suetsugu, Manabu Hirakawa, Satoshi Goishihara, Koichi Kinoshita, Hidenori Nakamura, Koujiro Ohkawa, Tetsuo Matsukura, Isao Inoue
  • Patent number: 11279999
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: March 22, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
  • Publication number: 20220020952
    Abstract: A manufacturing method for an electronic device includes a preparation step of preparing a layered body including a substrate, two or more first electrodes, and organic layers, the substrate having a first surface and a second surface that is positioned opposite to the first surface, the two or more first electrodes positioned above the first surface of the substrate, the organic layers positioned above the first electrodes; a second electrode formation step of forming a second electrode above the organic layers so that the second electrode overlaps the two or more first electrodes when viewed in a normal direction to the first surface of the substrate; and a removal step of partly removing regions of the second electrode that is positioned between the first electrodes in plan view.
    Type: Application
    Filed: June 2, 2021
    Publication date: January 20, 2022
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Isao INOUE, Yoko NAKAMURA
  • Publication number: 20210317562
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo AOKI, Chikao IKENAGA, Isao INOUE
  • Patent number: 10912155
    Abstract: A heating plate 10 includes: a pair of glass plates 11, 12; a conductive pattern 40, 70 disposed between the pair of glass plates 11, 12 and defining a plurality of opening areas 43, 73; and a joint layer 13, 14 disposed between the conductive pattern 40, 70 and at least one of the pair of glass plates 11, 12; wherein the conductive pattern 40, 70 includes a plurality of connection elements 44, 74 that extend between two branch points 42, 72 to define the opening areas 43, 73; and a total value of lengths of straight line segments connecting the two branch points 42, 72 is less than 20% of a total value of the plurality of connection elements 44, 74.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: February 2, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi Suetsugu, Manabu Hirakawa, Satoshi Goishihara, Koichi Kinoshita, Hidenori Nakamura, Koujiro Ohkawa, Tetsuo Matsukura, Isao Inoue