Patents by Inventor Isao Inoue

Isao Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210317562
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo AOKI, Chikao IKENAGA, Isao INOUE
  • Patent number: 10912155
    Abstract: A heating plate 10 includes: a pair of glass plates 11, 12; a conductive pattern 40, 70 disposed between the pair of glass plates 11, 12 and defining a plurality of opening areas 43, 73; and a joint layer 13, 14 disposed between the conductive pattern 40, 70 and at least one of the pair of glass plates 11, 12; wherein the conductive pattern 40, 70 includes a plurality of connection elements 44, 74 that extend between two branch points 42, 72 to define the opening areas 43, 73; and a total value of lengths of straight line segments connecting the two branch points 42, 72 is less than 20% of a total value of the plurality of connection elements 44, 74.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: February 2, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi Suetsugu, Manabu Hirakawa, Satoshi Goishihara, Koichi Kinoshita, Hidenori Nakamura, Koujiro Ohkawa, Tetsuo Matsukura, Isao Inoue
  • Publication number: 20200248297
    Abstract: A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 6, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Daigo Aoki, Chikao Ikenaga, Isao Inoue
  • Patent number: 10384649
    Abstract: A heating plate 10 includes: a pair of glass plates 11, 12; a conductive pattern 40, 70 disposed between the pair of glass plates 11, 12 and defining a plurality of opening areas 43, 73; and a joint layer 13, 14 disposed between the conductive pattern 40, 70 and at least one of the pair of glass plates 11, 12; wherein the conductive pattern 40, 70 includes a plurality of connection elements 44, 74 that extend between two branch points 42, 72 to define the opening areas 43, 73; and a rate of the connection elements 44, 74, which are straight line segments connecting the two branch points 42, 72, relative to the plurality of connection elements 44, 74, is less than 20%.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: August 20, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi Suetsugu, Manabu Hirakawa, Satoshi Goishihara, Koichi Kinoshita, Hidenori Nakamura, Koujiro Ohkawa, Tetsuo Matsukura, Isao Inoue
  • Publication number: 20190248336
    Abstract: A heating plate includes: a pair of glass plates; a conductive pattern disposed between the pair of glass plates and defining a plurality of opening areas; and a joint layer disposed between the conductive pattern and at least one of the pair of glass plates; wherein the conductive pattern includes a plurality of connection elements that extend between two branch points to define the opening areas; and a rate of the connection elements, which are straight line segments connecting the two branch points, relative to the plurality of connection elements, is less than 20%.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi SUETSUGU, Manabu Hirakawa, Satoshi Goishihara, Koichi Kinoshita, Hidenori Nakamura, Koujiro Ohkawa, Tetsuo Matsukura, Isao Inoue
  • Patent number: 10315625
    Abstract: A heating plate 10 includes: a pair of glass plates 11, 12; a conductive pattern 40, 70 disposed between the pair of glass plates 11, 12 and defining a plurality of opening areas 43, 73; and a joint layer 13, 14 disposed between the conductive pattern 40, 70 and at least one of the pair of glass plates 11, 12; wherein the conductive pattern 40, 70 includes a plurality of connection elements 44, 74 that extend between two branch points 42, 72 to define the opening areas 43, 73; and a rate of the connection elements 44, 74, which are straight line segments connecting the two branch points 42, 72, relative to the plurality of connection elements 44, 74, is less than 20%.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: June 11, 2019
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi Suetsugu, Manabu Hirakawa, Satoshi Goishihara, Koichi Kinoshita, Hidenori Nakamura, Koujiro Ohkawa, Tetsuo Matsukura, Isao Inoue
  • Publication number: 20190035906
    Abstract: Provided is a field effect transistor (FET) including a gate insulating film with a laminated (two-layer) structure having more improved characteristics for practical use. The FET includes a perovskite-type structure single-crystalline composite oxide substrate 1 that forms a channel layer; and a gate insulating film with a laminated structure in which para-xylylene polymer films 4 and 5 and hafnium oxide 6 are laminated in this order on the single-crystalline composite oxide substrate 1.
    Type: Application
    Filed: January 18, 2017
    Publication date: January 31, 2019
    Inventor: Isao Inoue
  • Publication number: 20170223779
    Abstract: A heating plate 10 includes: a pair of glass plates 11, 12; a conductive pattern 40, 70 disposed between the pair of glass plates 11, 12 and defining a plurality of opening areas 43, 73; and a joint layer 13, 14 disposed between the conductive pattern 40, 70 and at least one of the pair of glass plates 11, 12; wherein the conductive pattern 40, 70 includes a plurality of connection elements 44, 74 that extend between two branch points 42, 72 to define the opening areas 43, 73; and a total value of lengths of straight line segments connecting the two branch points 42, 72 is less than 20% of a total value of the plurality of connection elements 44, 74.
    Type: Application
    Filed: March 28, 2017
    Publication date: August 3, 2017
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi SUETSUGU, Manabu HIRAKAWA, Satoshi GOISHIHARA, Koichi KINOSHITA, Hidenori NAKAMURA, Koujiro OHKAWA, Tetsuo MATSUKURA, Isao INOUE
  • Publication number: 20160311402
    Abstract: A heating plate 10 includes: a pair of glass plates 11, 12; a conductive pattern 40, 70 disposed between the pair of glass plates 11, 12 and defining a plurality of opening areas 43, 73; and a joint layer 13, 14 disposed between the conductive pattern 40, 70 and at least one of the pair of glass plates 11, 12; wherein the conductive pattern 40, 70 includes a plurality of connection elements 44, 74 that extend between two branch points 42, 72 to define the opening areas 43, 73; and a rate of the connection elements 44, 74, which are straight line segments connecting the two branch points 42, 72, relative to the plurality of connection elements 44, 74, is less than 20%.
    Type: Application
    Filed: November 17, 2015
    Publication date: October 27, 2016
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hirotoshi SUETSUGU, Manabu HIRAKAWA, Satoshi GOISHIHARA, Koichi KINOSHITA, Hidenori NAKAMURA, Koujiro OHKAWA, Tetsuo MATSUKURA, Isao INOUE
  • Patent number: 9249429
    Abstract: Provided is a strain belonging to the genus Aurantiochytrium, the strain being characterized by there being at least 10 mass % of squalene in all the lipids produced by the strain, and by forming colonies exhibiting an orange-to-red color.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: February 2, 2016
    Assignees: University of Tsukuba
    Inventors: Makoto Watanabe, Kunimitsu Kaya, Makato Shiho, Atsushi Nakazawa, Isao Inoue, Daisuke Honda
  • Publication number: 20130288327
    Abstract: Provided is a strain belonging to the genus Aurantiochytrium, the strain being characterized by there being at least 10 mass % of squalene in all the lipids produced by the strain, and by forming colonies exhibiting an orange-to-red color.
    Type: Application
    Filed: December 9, 2011
    Publication date: October 31, 2013
    Applicants: NEW BUSINESS INCUBATION NETWORK CO., LTD., UNIVERSITY OF TSUKUBA
    Inventors: Makoto Watanabe, Kunimitsu Kaya, Makato Shiho, Atsushi Nakazawa, Isao Inoue, Daisuke Honda
  • Patent number: 8497140
    Abstract: An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: July 30, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kasumi Ol, Takaki Miyachi, Isao Inoue, Koujiro Ohkawa, Hiroki Nakagawa
  • Publication number: 20120118379
    Abstract: Disclosed herein is a dye-sensitized solar cell that prevents reverse electron transfer by a simple method and has significantly-improved power generation efficiency. The dye-sensitized solar cell includes a base material for dye-sensitized solar cell having a base material and a first electrode layer provided on the base material; a counter electrode base material arranged so as to oppose to the base material for dye-sensitized solar cell and functions as an electrode; an electrolyte layer provided between the base material for dye-sensitized solar cell and the counter electrode base material; and a porous layer laminated on either the base material for dye-sensitized solar cell or the counter electrode base material, provided so as to come into contact with the electrolyte layer, and contains a dye-sensitizer-supported fine particle of a metal oxide semiconductor.
    Type: Application
    Filed: July 6, 2010
    Publication date: May 17, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Isao Inoue, Naohiro Obonai, Koujirou Ookawa
  • Publication number: 20110183442
    Abstract: An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%.
    Type: Application
    Filed: March 25, 2011
    Publication date: July 28, 2011
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kasumi OI, Takaki MIYACHI, Isao INOUE, Koujiro OHKAWA, Hiroki NAKAGAWA
  • Patent number: 7935884
    Abstract: An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: May 3, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kasumi Oi, Takaki Miyachi, Isao Inoue, Koujiro Ohkawa, Hiroki Nakagawa
  • Patent number: 7863594
    Abstract: An objective of the present invention is to provide a switching device that shows two markedly different stable resistance characteristics reversibly and repetitively, and which is applicable to highly integrated nonvolatile memories.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: January 4, 2011
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Hiroyuki Akinaga, Shuichiro Yasuda, Isao Inoue, Hidenori Takagi
  • Patent number: 7752843
    Abstract: A piston is guided by a two-point guide thus allowing a working liquid to smoothly flow into or flow out from a liquid chamber. The liquid chamber is formed into a donut shape and an opening of a passage of the working liquid is arranged at a center portion of the donut. The piston adopts a stepped structure which has a large-diameter portion and a small-diameter portion. The large-diameter portion is fitted into a first cylinder bore and a small-diameter portion is fitted into a second cylinder bore. The working liquid flows into or flows out from the hydraulic chamber through groove passages formed on an outer periphery of the small-diameter portions.
    Type: Grant
    Filed: November 26, 2005
    Date of Patent: July 13, 2010
    Assignee: Bosch Corporation
    Inventors: Isao Inoue, Kensyo Tsushima
  • Publication number: 20100012911
    Abstract: An objective of the present invention is to provide a switching device that shows two markedly different stable resistance characteristics reversibly and repetitively, and which is applicable to highly integrated nonvolatile memories.
    Type: Application
    Filed: August 8, 2006
    Publication date: January 21, 2010
    Applicant: National Institute of Advanced Industrial Science and Technology
    Inventors: Hiroyuki Akinaga, Shuichiro Yasuda, Isao Inoue, Hidenori Takagi
  • Patent number: 7521515
    Abstract: The invention mainly aims to provide an economical filler layer for a solar cell module which is excellent in the adhesion property to a transparent front substrate and a backside protective sheet, does not worsen the working environments, and causes no adverse effect on a solar cell element or electrodes at the time of production. To accomplish the aim, the invention provides a filler layer for a solar cell module containing a silane-modified resin obtained by polymerizing an ethylenic unsaturated silane compound and a polyethylene for polymerization and characterized in that the filler layer for a solar cell module has a gel fraction of 30% or lower when the filler layer for a solar cell module is used in a solar cell module.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: April 21, 2009
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kasumi Oi, Hiroki Nakagawa, Takaki Miyachi, Isao Inoue, Koujiro Ohkawa
  • Patent number: 7476758
    Abstract: The present invention provides a process for preparing a novel phenylalanine derivative of the formula (I): wherein X1 is a halogen atom, X2 is a halogen atom, Q is a group of the formula β€”CH2β€” or β€”(CH2)2β€” and Y is a lower alkyl group, or a pharmaceutically acceptable salt thereof, which has excellent inhibitory effects on ?4 integrin-mediated cell adhesion, and an intermediate useful in the process.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: January 13, 2009
    Assignee: Mitsubishi Tanbe Pharma Corporation
    Inventors: Isao Inoue, Toru Kuroda, Ryuzo Yoshioka