Abstract: In a wafer having a plurality of integrated circuit chips of different chip sizes formed on the wafer, each of the integrated circuit chips having a number of externally connecting lands uniformly distributed over the whole surface of the chip with equal pitches to depict a matrix or a repeated pattern of an equilateral triangle, a plurality of power supply lands of the externally connecting lands are located to depict a cross having a crossing point positioned at a center of the chip. A geometrical location of the power supply lands is congruent to all said integrated circuit chips of different chip sizes. The pitch between adjacent lands positioning a dicing line therebetween is one obtained by multiplying the pitch between adjacent lands positioning no dicing line therebetween, by a positive integer.

Abstract: In a semiconductor device having a first conductor layer (25) formed on a first insulator layer (23) and a second insulator layer (29) formed on the first conductor layer, a second conductor layer (31) has a primary conductor film (35) formed on the second insulator layer, a secondary conductor film (37) formed on the primary conductor film, and a ternary conductor film (63) formed on the secondary conductor film. The second insulator layer has a recessed surface (29b) which defines a contact perforation exposing a predetermined area of an upper surface (25a) of the first conductor layer. The secondary conductor film is further formed on the recessed surface and the predetermined area. The primary conductor film has a primary resistance value. The secondary conductor film has a secondary resistance value which is lower than the primary resistance value.

Abstract: In a process for forming a multilayer wiring conductor structure, an interlayer insulator film is deposited on a surface including an upper surface of a lower layer wiring conductor, and the deposited interlayer insulator film is planarized so as to expose the upper surface of the lower layer wiring conductor. Then, a bonding metal film is deposited on a surface of the interlayer insulator film exposing the upper surface of the lower layer wiring conductor, and a photoresist film is coated on the bonding metal film and patterned. By using the patterned photoresist, a hole for formation of a connection pillar between the lower layer wiring conductor and a possible upper layer wiring conductor and a patterning of the bonding metal film are simultaneously formed. Accordingly, the bonding metal film can be formed and patterned on the upper surface of the lower layer wiring conductor without increasing the photolithography steps.

Abstract: A process is provided for producing a coated printing paper by first applying a pigment containing layer, superposing thereon a surface layer of a thermoplastic latex having a second-order transition of at least 80.degree. C. and an average particle size of smaller than 100 nm to produce a coated printing paper having both superior printability and gloss. Another process is provided for producing a coated printing paper by first applying a pigment containing layer, superposing thereon a surface layer of a thermoplastic latex having a second-order transition of at least 80.degree. C. an average particle size of smaller than 100 nm and lubricants, and treating the surface layer with a calender at a temperature, to produce a coated printing paper having both superior printability and high gloss.

Abstract: A semiconductor device of a multilayer interconnection structure which includes a plurality of insulating layers and a plurality of metal interconnection layers. The uppermost metal interconnection layer is formed in a hall in the uppermost interlayer insulating layer. The uppermost interconnection layer is formed as a bonding pad portion and a part of the layer is formed into a ring-shaped portion so as to cover the side portion of the hall.

Abstract: A polycrystalline silicon layer 9 for a base leading electrode is formed on an element forming region divided by an element isolating layer which is formed by burying a BPSG film 8 in a groove. A depression generated on the element isolating layer is filled with a PSG film 11 which is formed as a part of an interlayer insulating film on the surface of the device including the polycrystalline silicon layer 9 by the spin-coating method so that the upper surface of the device is flattened. A polycrystalline silicon layer 13 is provided on the element isolating layer as a resistor layer so that the resistor layer is disposed between the adjacent transistors. The area of a circuit block is reduced to achieve a high integration and reduction in parasitic capacitance. This enables the high speed operation.

Abstract: A process is provided for producing a coated printing paper by first applying a pigment containing layer, superposing thereon a surface layer of a thermoplastic polymeric latex having a second-order transition temperature of at least 80.degree. C., and treating the surface layer with a calendar at a temperature less than the second-order transition temperature, to produce a coated printing paper having both superior printability and high gloss.

Abstract: This invention relates to a method for measuring a gloss profile of the surface of materials as paper, specifically coated paper, synthetic resin film, metals and the like.This method comprises the step of applying a spot of a monochromatic ultraviolet light to the surface of sample, moving the spot on the surface of the sample, photoelectrically converting a reflected light of each spot, obtained with a same reflective angle as an incident angle, and comparing and calculating the reflectance to determine the gloss profile.

Abstract: A recording sheet for thermal dye-transfer type recording method, having a coating layer which is placed on a substrate, is contacted with a coloring material layer containing sublimable dye and on which the dye is transferred by heating. The coating layer includes as a pigment precipitated calcium carbonate of at least 25,000 cm.sup.2 /g specific-surface-area and as a binder saturated polyester or a mixture of saturated polyester with polyvinyl pyrrolidone. The sheet provides a clear record with superior color density.

Abstract: A recording sheet for thermal-dye transfer type recording having a coating layer which is placed on a substrate which is contacted with a coloring material layer containing sublimable dye and on which the dye is transferred by heating, wherein the coating layer includes both particular fine silica and particular binder, whereby the sheet provides a clear record with superior color density.

Abstract: A recording sheet for thermal dye-transfer type recording having a coating layer which is placed on a substrate, which is contacted with a coloring material layer containing sublimable dye and on which the sublimable dye is transferred by heating, wherein the coating layer includes an aminoalkyd resin, whereby the recording sheet provides a record with superior color density and causes no heat-adhesion between the recording sheet and a thermal transfer substrate.

Abstract: Packing material for foodstuff is sterilized with hydrogen peroxide. Residual hydrogen peroxide on the material is then removed by contacting the material with an anti-oxidant or reducing agent which is an approved food additive. L-ascorbic acid is preferred.

Abstract: An antibacterial agent comprising one of dicarboxylic compounds or alkali metal salts thereof generally given by the formulaROOC(CH.sub.2).sub.n COOR'wherein R and R' are a hydrogen or an element of the alkali metal group, respectively, and n is an integer ranging from 11 to 14 inclusive, or a mixture of two or more of said compounds or alkali metal salts thereof, said antibacterial agent being stable in an aqueous solution and a small amount of addition thereof to foods exhibiting an improved antibacterial effect on gram-positive bacteria such as Staphylococcus aureus and Bacillus subtilis.

Abstract: The invention provides a process for producing coenzyme Q.sub.10 by cultivating a novel microorganism JY-155 which belongs to the genus Trichosporon (FERM-P4650, ATCC 20566) which we discovered, in a culture medium containing sulfite waste liquor as the carbon source. The microbial cells form and accumulate coenzyme Q.sub.10. These cells are then recovered from the culture and processed to obtain the coenzyme Q.sub.10 as a compound or to obtain it in usable form while still associated with at least some of the cell material.