Abstract: A multielectrode type fuse element manufactured by forming a shallow shaving portion 1 of a definite width in the long fuse material 9 in a longitudinal direction so as to form a thin area 2, punching from portions of the thin area 2 dependently on electrical conduction capacities of fuses so as to form a plurality of blowout portions 3, 3, forming a hook-like extending portion 6 on one side across the thin area 2 at an upper end of an input terminal 4 disposed in a direction perpendicular to the longitudinal direction of the long fuse material 9, forming a plurality of output terminals 5, 5 by punching from the long fuse material on a side of the hook-like extending portion 6 of the input terminal 4 in parallel with the input terminal 4 at an equal pitch, and forming the blowout portions 3, 3 to connect one side of an upper portion of a vertical section of the input terminal 4 and a lower tip of the hook-like extending portion 6 with top end of the plurality of output terminals 5, 5.

Abstract: A portable data processing apparatus such as a personal computer comprising in series a base portion, a top cover portion, a display housing portion, and a keyboard portion. These portions are pivotally connected one after another by first, second and third hinge means, respectively. The first, second and third hinge means are parallel to each other, so that the apparatus can adopt a spread position in which the keyboard portion and the display housing portion are spread to the front and a retracted position in which the keyboard portion overlaps the display housing portion. The top cover portion, the display housing portion, the keyboard portion, and the base portion are folded in a face-to-face relationship in the retracted position.

Abstract: A via hole structure for interlayer connection formed in an insulating film and a process for the formation of the same. Via holes are formed in an insulating film of a multilayer interconnected board or the like so as to have a shape such that when a metallic film for wiring is formed on the insulating film, the metal film can completely fill up the via holes. The via holes are formed by gradually increasing from the bottom toward the top of an insulating layer 8 the apertures of the via holes 7 formed in the insulating layer 8, comprised of a plurality of insulating resin film or photosensitive insulating resin film layers 2, 5, in a multilayer interconnected board comprising the insulating layer 8 laminated alternately with a wiring layer 13 comprised of an electric conductor.

Abstract: A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the heat generating device for transferring heat generated in the device to the cooling unit. The metal sherbet is metal, such as an In-Ga binary system, in which solids of an In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the device and the cooling unit.

Abstract: A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.

Abstract: A process for laser welding a cover and a casing, each made of aluminum or an aluminum-based alloy, via a nickel layer plated thereon, thereby forming a package for electronic devices, the process comprising the steps of: boring holes in sides of the casing, thereby providing holes through which input/output and source terminals can be inserted and be soldered hermetically to the casing; plating a nickel layer on the surface of the casing; mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and, welding the cover and the casing together by pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight, and sealing the cover and the casing hermetically.

Abstract: A fuse comprises a slender tube, a fuse element installed therein and terminals attached to both ends of the tube, wherein said fuse element being characterized by a plate substance having supporting sections extended respectively from each end of a fusing section, said supporting sections connected electrically to each terminal and said fusing section being bent at least at one part thereof.