Abstract: A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.

Abstract: A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.

Abstract: Individual two-dimensional barcodes are provided for individual chips arrayed on a wafer, individual lead frames to each of which chips are bonded and individual packaged products constituted of resin sealed semiconductor chips based upon chip ID information, to enable information management to be implemented separately for individual chips, individual frames and individual chip products. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: Individual two-dimensional barcodes are provided for individual chips arrayed on a wafer, individual lead frames to each of which chips are bonded and individual packaged products constituted of resin sealed semiconductor chips based upon chip ID information, to enable information management to be implemented separately for individual chips, individual frames and individual chip products. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: Individual two-dimensional barcodes are provided for individual chips arrayed on a wafer, individual lead frames to each of which chips are bonded and individual packaged products constituted of resin sealed semiconductor chips based upon chip ID information, to enable information management to be implemented separately for individual chips, individual frames and individual chip products. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: Individual two-dimensional barcodes are provided for individual chips arrayed on a wafer, individual lead frames to each of which chips are bonded and individual packaged products constituted of resin sealed semiconductor chips based upon chip ID information, to enable information management to be implemented separately for individual chips, individual frames and individual chip products Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: According to the present invention, individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead frames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31, individual frames 93 and individual chip products 171. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: According to the present invention, individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead fames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31, individual frames 93 and individual chip products 171. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: Individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead frames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31, individual frames 93 and individual chip products 171. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: According to the present invention, individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead frames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31, individual frames 93 and individual chip products 171. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: According to the present invention, individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead fames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31, individual frames 93 and individual chip products 171. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: According to the present invention, individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead frames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31, individual frames 93 and individual chip products 171. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.

Abstract: A computerized system for providing various sorts of information regarding the current progress in a mass production process, for the ultimate purpose to allow a manager in charge of the mass production process to use the information to decide various parameters influential for the following processes, the computerized system having a various function to analyze the current position in the mass production process.

Abstract: A steering shaft assembly for automotive vehicles comprises an upper shaft mounted thereon with a steering wheel, a lower shaft rotatably supported in place within a column tube and telescopically connected to the upper shaft in such a manner to permit axial adjustment of the upper shaft, and a lock mechanism for releasably fastening the upper shaft to the lower shaft in its adjusted position, a pair of stopper elements respectively integral with the upper and lower shafts to be abutted against each other when the upper shaft is moved downward over a predetermined stroke, an annular tapered projection integral with one of the shafts, and a single shock absorber element of elastic material in the form of a short sleeve member coupled with the other shaft and located between the stopper elements. The shock absorber element is formed at one end thereof with an annular tapered portion to be resiliently coupled over the annular tapered projection by abutment with the stopper elements.