Abstract: According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Abstract: According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Abstract: According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Abstract: A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.

Abstract: A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.

Abstract: According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Abstract: In an arrangement of carrying out a switch operation of operating a driven mechanism by an operating member operated by a user and bringing and detaching contacts provided to movable contact pieces into contact with and from fixed contacts by deforming and recovering the movable contact by the operated driven mechanism, the contacts of the movable contact pieces are formed by carrying out mechanical working of projecting portions of the movable contact pieces.

Abstract: A slider operated to slide by a lever for light is constructed by an arrangement capable of being integrated by inserting a portion thereof to a cylindrical portion of a slide guide portion provided at an insulator. Thereby, an integrating performance can be promoted in comparison with that of a structure of squeezing the slider by 2 parts. Further, a clearance in a height direction of the slider can be controlled by one part of the insulator, and therefore, a variation thereof can be reduced in comparison with that of the case of controlling the clearance by 2 parts.

Abstract: Since a MIST position is set to be positioned next to an AUTO position, when a control lever is operated from the AUTO position to the MIST position, the control lever can be so operated through one step without having to pass through another operation mode position, whereby by operating the control lever from the AUTO position to the MIST position to be held operative in the position, the wiper can be put in operation. In addition, by operating the control lever to stay in the AUTO position, the wiper can automatically be put in operation according to the amount of rain.

Abstract: Since a MIST position is set to be positioned next to an AUTO position, when a control lever is operated from the AUTO position to the MIST position, the control lever can be so operated through one step without having to pass through another operation mode position, whereby by operating the control lever from the AUTO position to the MIST position to be held operative in the position, the wiper can be put in operation. In addition, by operating the control lever to stay in the AUTO position, the wiper can automatically be put in operation according to the amount of rain.

Abstract: First stopper face (7b) is provided on each of click teeth (7) of a click teeth portion 8 of a click mechanism (14) affording a click feeling during the rotation-operation of a rotary knob (11). Second stopper face (13b) is provided on a tooth portion (13) of a click piece (10). The first stopper face (7b) and the second stopper face (13b) cooperate to prevent the rotary knob (11) from rotating in a direction opposite to a direction indicated by an arrow A. Consequently, there is no need for providing a stopper as an additional component.

Abstract: First stopper face (7b) is provided on each of click teeth (7) of a click teeth portion 8 of a click mechanism (14) affording a click feeling during the rotation-operation of a rotary knob (11). Second stopper face (13b) is provided on a tooth portion (13) of a click piece (10). The first stopper face (7b) and the second stopper face (13b) cooperate to prevent the rotary knob (11) from rotating in a direction opposite to a direction indicated by an arrow A. Consequently, there is no need for providing a stopper as an additional component.