Patents by Inventor Isao Muragishi

Isao Muragishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8349736
    Abstract: A base conductive member is formed on a surface and in a hole section of a substrate, and a resist is formed on a part of the base conductive member in which a conductive layer is not to be formed. The conductive layer is formed on a part except for the part in which the resist has been formed, and a mask metal is formed on the conductive layer. Then, the resist is removed, and the base conductive member is etched using the mask metal as a mask to form the conductive layer into a predetermined shape.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: January 8, 2013
    Assignee: Panasonic Corporation
    Inventors: Isao Muragishi, Kai Takayuki, Saito Daishiro, Daisuke Yamamoto, Takeshi Koiwasaki
  • Publication number: 20120115323
    Abstract: A base conductive member is formed on a surface and in a hole section of a substrate, and a resist is formed on a part of the base conductive member in which a conductive layer is not to be formed. The conductive layer is formed on a part except for the part in which the resist has been formed, and a mask metal is formed on the conductive layer. Then, the resist is removed, and the base conductive member is etched using the mask metal as a mask to form the conductive layer into a predetermined shape.
    Type: Application
    Filed: February 17, 2011
    Publication date: May 10, 2012
    Inventors: Isao Muragishi, Takayuki Kai, Daishiro Saito, Daisuke Yamamoto, Takeshi Koiwasaki
  • Patent number: 8016982
    Abstract: The present invention is to provide a sputtering apparatus and a sputtering method, specifically, a magnetron sputtering apparatus having a magnetron electrode capable of generating plasma in a wide region near the surface of a target, and a sputtering method using the apparatus. Thereby, a magnetic field shape enabling to generate plasma in a wide region near the surface of a target is realized, the use efficiency of the target material is increased, and dusts and abnormal electric discharges may be prevented. Magnetic circuit 10 of a magnetron electrode is set as “magnetic circuit 10 in which center perpendicular magnet 101, inside parallel magnet 103, outside parallel magnet 104, and perimeter perpendicular magnet 102 are arranged” from the central part of target 2 toward the perimeter part, and inside parallel magnet 103 is brought close to target 2.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: September 13, 2011
    Assignee: Panasonic Corporation
    Inventors: Masahiro Yamamoto, Takeshi Koiwasaki, Isao Muragishi, Hitoshi Yamanishi
  • Patent number: 7814796
    Abstract: Provided is a partial pressure measuring method and a partial pressure measuring apparatus by which a partial pressure distribution is easily measured in a vacuum chamber. The partial pressure measuring method and the partial pressure measuring apparatus includes: moving a local plasma source dedicated to partial pressure measuring provided in the vacuum chamber, to a location at which the measuring is to be performed; and measuring a partial pressure distribution in the vacuum chamber, by receiving emission of plasma generated by the local plasma source through a window which is formed in a wall part of the vacuum chamber and through which the emission passes, and thereby performing emission spectral analysis on intensity of the emission.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: October 19, 2010
    Assignee: Panasonic Corporation
    Inventors: Masahiro Yamamoto, Takeshi Koiwasaki, Hitoshi Yamanishi, Isao Muragishi, Mitsuhiro Yoshinaga
  • Publication number: 20090139853
    Abstract: The present invention is to provide a sputtering apparatus and a sputtering method, specifically, a magnetron sputtering apparatus having a magnetron electrode capable of generating plasma in a wide region near the surface of a target, and a sputtering method using the apparatus. Thereby, a magnetic field shape enabling to generate plasma in a wide region near the surface of a target is realized, the use efficiency of the target material is increased, and dusts and abnormal electric discharges may be prevented. Magnetic circuit 10 of a magnetron electrode is set as “magnetic circuit 10 in which center perpendicular magnet 101, inside parallel magnet 103, outside parallel magnet 104, and perimeter perpendicular magnet 102 are arranged” from the central part of target 2 toward the perimeter part, and inside parallel magnet 103 is brought close to target 2.
    Type: Application
    Filed: November 18, 2008
    Publication date: June 4, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Masahiro YAMAMOTO, Takeshi KOIWASAKI, Isao MURAGISHI, Hitoshi YAMANISHI
  • Publication number: 20080257014
    Abstract: Provided is a partial pressure measuring method and a partial pressure measuring apparatus by which a partial pressure distribution is easily measured in a vacuum chamber. The partial pressure measuring method and the partial pressure measuring apparatus includes: moving a local plasma source dedicated to partial pressure measuring provided in the vacuum chamber, to a location at which the measuring is to be performed; and measuring a partial pressure distribution in the vacuum chamber, by receiving emission of plasma generated by the local plasma source through a window which is formed in a wall part of the vacuum chamber and through which the emission passes, and thereby performing emission spectral analysis on intensity of the emission.
    Type: Application
    Filed: April 16, 2008
    Publication date: October 23, 2008
    Inventors: Masahiro Yamamoto, Takeshi Koiwasaki, Hitoshi Yamanishi, Isao Muragishi, Mitsuhiro Yoshinaga
  • Patent number: 6407004
    Abstract: As an electrically conductive layer or a lower layer of conductor layers to be patterned, a conductor layer which is dry-etchable with an oxygen-containing gas is provided. A dry etching process of the conductor layer with the oxygen-containing gas is performed highly selectively to a ground film.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: June 18, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadashi Kimura, Isao Muragishi, Hiroyoshi Sekiguchi, Masaya Sakaguchi, Hiroyasu Tsuji, Satoru Mitani
  • Patent number: 5167687
    Abstract: According to the bonding method of flat electrodes of the present invention, a crystal glass material is arranged between electrodes, heated, and melted while the flat electrodes are pressured, and the melted crystal glass material is fused and re-crystallized to the surface of each flat electrode, so that the flat electrodes can be bonded with strong bonding force. Since a plate-like spacer or an application glass of a low melting point is not used in the method, disadvantages resulting from the spacer or the glass can be removed.
    Type: Grant
    Filed: January 22, 1991
    Date of Patent: December 1, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Isao Muragishi, Takashi Kanehisa, Takashi Suzuki, Tetsuo Hori
  • Patent number: 5129933
    Abstract: A method and apparatus for joining flat-plate electrodes wherein a spacer, to which a joining material such as a low-melting-point crystallized glass containing a crystallization promoting agent is applied, is interposed between the electrodes to be joined. The electrodes and spacer are placed and held between upper and lower attraction dies. The upper and lower attraction dies are placed between upper and lower heating blocks for heating and pressing the electrodes and spacer through the attraction dies to join the electrodes via molten joining material.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: July 14, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Isao Muragishi, Takashi Suzuki, Takashi Kanehisa, Tetuo Hori, Asao Iguchi
  • Patent number: 5104343
    Abstract: A method is disclosed for manufacturing a flat display device including line cathodes arranged at regular intervals, a plurality of flat electrodes arranged so as to be spaced apart by a predetermined distance from one another to control line electron beams generated from the cathodes, and a fluorescent substance which emits a light as a result of a collision of the electron beam. The method includes the steps of: arranging a bar-shaped low-melting glass at a connecting position where the beam generated from the cathode does not pass through; positioning the electrodes and the glass against each other when the electrodes are fixed to connect to the glass; fixing initial connecting portions of the electrodes to the glass, each of which is located outside an outer frame of each electrode; heating and fusing the glass to connect it to the electrodes; and removing the initial connecting portions of the electrodes arranged outside the outer frames of the electrodes from the electrodes.
    Type: Grant
    Filed: October 26, 1990
    Date of Patent: April 14, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Isao Muragishi, Takashi Suzuki, Takashi Kanehisa, Mitsunori Yokomakura, Tetsuo Hori
  • Patent number: 5003219
    Abstract: A fixed construction for plate electrodes in a flat display unit, wherein holes provided along a common axis through a plurality of plate electrodes have a diameter smaller than that of a tapered insulating pin to be inserted therein, and the peripheral portions of the holes are formed in a thin or tapered construction, thereby supporting and fixing the plate electrodes in position without interposing a spacer and without causing deformation to the areas around the peripheries of the holes formed in the plate electrodes when insulating pins are fitted.
    Type: Grant
    Filed: November 8, 1989
    Date of Patent: March 26, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Isao Muragishi, Takashi Suzuki, Takashi Kanehisa, Makoto Inada
  • Patent number: 4651471
    Abstract: An edge-rounding method and an apparatus therefor, for chamfering the peripheral edge of a workpiece having a planar surface by causing the peripheral edge to be be engaged under pressure with a grinding surface of a grinding device. The grinding device employed is of two types, one type being a grinding cylinder having a grinding surface and the other type being an abrasive tape having an abrasive surface and moved around a rotary drum. The edge-rounding is performed on the workpiece so as to satisfy the relationship of [(x/r)-(L/2r)]<0.015, wherein r represents the radius of the grinding surface, L represents the minimum dimension of the planar surface during the rotation of the workpiece and x represents the distance between the plane in which the workpiece pivots and the axis of rotation of the grinding device.
    Type: Grant
    Filed: April 23, 1985
    Date of Patent: March 24, 1987
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masashi Makino, Kunio Nakada, Isao Muragishi, Syozi Nishitani
  • Patent number: 4635403
    Abstract: An edge rounding machine for performing edge rounding of an outer edge portion of a machining face of a workpiece such as a floppy disk head, etc., including a cylindrical rotary member having, at its outer periphery, cutting edges, a holder for supporting the workpiece such that the machining face of the workpiece is brought into contact, at the outer edge portion, with a grinding face of the cylindrical rotary member at an angle, a rotary device for rotating the workpiece about its rotary centerline perpendicular to the machining face, a pivotal device for pivoting the workpiece, a support member for retractably guiding the holder along the rotary centerline of the workpiece, and an urging device for urging the workpiece towards the grinding face.
    Type: Grant
    Filed: June 12, 1985
    Date of Patent: January 13, 1987
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masashi Makino, Kunio Nakada, Isao Muragishi, Syozi Nishitani