Abstract: There is provided a polishing apparatus and a polishing method for use with the apparatus. The apparatus includes a lower turn table having a polishing surface on its upper surface, an upper turn table having a polishing surface on its lower surface, and in addition, an intermediate turn table having polishing surfaces on its upper and lower surfaces and interposed between the lower turn table and the upper turn table. The apparatus further includes a carrier rotating mechanism adaptable to rotate a disk-like carrier rotating on its axis while revolve the disk-like carrier around the rotational axis of the turn tables, and a table rotating mechanism for rotating the turn tables. The carriers can be prepared not only on the lower turn table but the intermediate turn table, and works can be loaded on the carriers prepared on the lower and intermediate turn tables. The works polished at a unit of machine operation is so many that productivity is improved.

Abstract: In a polishing machine for polishing parts between a table and an upper polishing head, the upper polishing head includes push rods to clear the workpieces after a polishing operation. A push ring engages the push rods as a polishing head is being raised, holding the workpieces in position on the table.

Abstract: A polishing device is formed of a pair of rotatable and elevatable upper supporting members provided with ring shape polishing pads at lower surface peripheries thereof, a pair of rotatable lower supporting members provided with ring shape polishing pads at upper surface peripheries thereof, a rotatable and elevatable disc holding device for holding a disc to be polished, and an arm for supporting the upper supporting members and the disc holding device. The polishing device further includes driving devices for rotating the upper supporting members, the lower supporting members and the disc holding device, respectively. The disc is independently rotated in a direction opposite to a rotating direction of the upper and lower supporting members to improve polishing efficiency. By setting rotating speeds of the supporting members and the disc, a regular working mark can be formed on the disc.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.

Abstract: A specular machining apparatus for giving a specular machining or mirror-like surface to a peripheral edge portion, in particular a chamfered portion, of typically a semiconductor wafer such as a silicon wafer. This mirror-like surface is provided to smooth out the relatively rough surface formed by etching to remove a strained layer which is generated as a result of grinding work. The mirror-like surface tends to reject the attachment of dirt, which is desirable. The specular machining apparatus is of simple construction and easy to use, comprising a chuck table plus chuck means for holding a wafer having a chamfered peripheral edge portion. The chuck table rotates the wafer held by the chuck about the wafer axis. A polishing ring is disposed to be freely rotatable around an axis perpendicular to the axis of the wafer on the chuck table, to permit the polishing surface on the outer periphery to be accessable for polishing.

Abstract: Described herein is an edge polisher for polishing chamfered edge portions on the front and rear sides of work, including a first machining stage for polishing the front side of work and a second machining stage for polishing the rear side of work, along with mechanisms for supplying, positioning, transferring, reversing and ejecting work. In the first and second machining stages, a work is chucked on each of index units which are mounted on an intermittently rotating index table and revolved around a polishing drum located at the center of the index table, pressing chamfered edge portions of the works against the polishing drum to give a polishing treatment thereto.

Abstract: Described herein is a flat lapping machine capable of precision-abrading simultaneously flat surfaces on the front and rear sides of a work in the fashion of lapping, polishing and grinding machines. The present invention contemplates to provide a flat lapping machine which is simplified in construction as compared with conventional flap lapping machines having a large number of carriers in planetary motions, and which can stop the respective carriers easily in specific positions and directions at the end of a lapping operation. To this end, the present invention employs a large number of support gear mechanisms each constituted by a plural number of small gears and located at uniform intervals around a center gear, rotatably supporting the respective carriers in predetermined positions while the respective carriers are driven by the center gear.

Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.