Patents by Inventor Isao Okura

Isao Okura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7143651
    Abstract: A pressure sensor comprises a housing having a pressure introduction hole, a pressure detecting element formed of a semiconductor device having the piezoelectric resistance effect, a holder for fixing the pressure detecting element, and a connector case. The pressure detecting element and the holder are airtightly joined to form a pressure sensor body in which an interior space is defined. A circuit board having an electrode pad is provided on the holder of the pressure sensor body, and a connector in the connector case and the electrode pad are connected by means of an electrically conductive spring body having elasticity. The holder is supported in the housing by means of a guide frame and an O-ring.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: December 5, 2006
    Assignee: Fujikoki Corporation
    Inventors: Keiji Sasaki, Isao Okura
  • Publication number: 20050061080
    Abstract: A pressure sensor comprises a housing having a pressure introduction hole, a pressure detecting element formed of a semiconductor device having the piezoelectric resistance effect, a holder for fixing the pressure detecting element, and a connector case. The pressure detecting element and the holder are airtightly joined to form a pressure sensor body in which an interior space is defined. A circuit board having an electrode pad is provided on the holder of the pressure sensor body, and a connector in the connector case and the electrode pad are connected by means of an electrically conductive spring body having elasticity. The holder is supported in the housing by means of a guide frame and an O-ring.
    Type: Application
    Filed: August 4, 2004
    Publication date: March 24, 2005
    Inventors: Keiji Sasaki, Isao Okura
  • Patent number: 6745633
    Abstract: A pressure sensor 1′ comprising a housing 10′ having a pressure introduction hole 12, a pressure sensing element 22 composed of a semiconductor element having piezoresistance effect, a holder 30 having fixed thereto the pressure sensing element 22, a guide member 98, a seal member 99 and a connector case 70, the pressure sensor element 22 and holder 30 joined in airtight manner to create a reference pressure chamber 72. On the holder 30 of the pressure sensor body is mounted a circuit board 40 having electrode pads, the electrode pads connected to connectors 80 fixed to the connector case 70 via conductive spring bodies 50. The guide member 98 supports holder 30, and in the opening 100 of the guide member 98 is placed the seal member 99.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: June 8, 2004
    Assignee: Fujikoki Corporation
    Inventors: Keiji Sasaki, Hitoshi Nagase, Isao Okura
  • Publication number: 20030107491
    Abstract: A pressure sensor 1′ comprising a housing 10′ having a pressure introduction hole 12, a pressure sensing element 22 composed of a semiconductor element having piezoresistance effect, a holder 30 having fixed thereto the pressure sensing element 22, a guide member 98, a seal member 99 and a connector case 70, the pressure sensor element 22 and holder 30 joined in airtight manner to create a reference pressure chamber 72. On the holder 30 of the pressure sensor body is mounted a circuit board 40 having electrode pads, the electrode pads connected to connectors 80 fixed to the connector case 70 via conductive spring bodies 50. The guide member 98 supports holder 30, and in the opening 100 of the guide member 98 is placed the seal member 99.
    Type: Application
    Filed: August 21, 2002
    Publication date: June 12, 2003
    Inventors: Keiji Sasaki, Hitoshi Nagase, Isao Okura