Patents by Inventor Isao Oobu

Isao Oobu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring board and semiconductor device
    Publication number: 20020171138
    Abstract: A multilayer wiring board having board having through holes in a thickness-wise direction, in which wiring board a semiconductor substrate mounted on the multi-layer wiring board has through holes in a thickness-wise direction, and entire areas, which the through holes in the semiconductor substrate occupy, in a plane orthogonal to the thickness-wise direction of the multilayer wiring board and of the semiconductor substrate are included in areas, which the through holes in the multilayer wiring board occupy.
    Type: Application
    Filed: August 31, 2001
    Publication date: November 21, 2002
    Inventors: Yasuo Osone, Norio Nakazato, Isao Oobu, Kiichi Yamashita, Shinji Moriyama, Takayuki Tsutsui, Mitsuaki Hibino, Chushiro Kusano, Yasunari Umemoto