Patents by Inventor Isao Sakamoto
Isao Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100329267Abstract: A data processing apparatus includes an input unit to input data and processing modules. The processing modules may be connected as part of a ring-shaped data transfer path to transfer data in one direction. Each processing module includes a communication unit configured to implement a first data processing path and a setting path and a processing unit configured to process data received by the communication unit. When using switching data to switch the processing modules performing on the first data processing path to the processing modules performing on the setting path, the switching data is processed on the first data processing path.Type: ApplicationFiled: June 15, 2010Publication date: December 30, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa
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Publication number: 20100329261Abstract: An apparatus, in which a plurality of modules is connected with each other and processes a packet having information, includes a storage unit for storing first information indicating an order of processing performed by its own module and second information indicating an order of modules which perform processing, a reception unit for receiving a first packet and transmitting the first packet including information corresponding to the first information, a processing unit for processing data included in the first packet, a generation unit for generating a second packet including the processed data and the second information, and a transmission unit for comparing the information included in the first packet with the second information included in the second packet, and transmitting the packet having a latter processing order.Type: ApplicationFiled: June 23, 2010Publication date: December 30, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa
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Publication number: 20100281237Abstract: In an information processing apparatus in which data processing is performed in a predetermined sequence by processing modules connected to a ring bus, if an amount of data generated by input data in the ring bus is not considered, the data amount exceeds an amount of data that can be held by the processing modules on the ring bus, and a data collision often occurs, so that processing efficiency of the ring bus deteriorates. An amount of data input into the ring bus is controlled so that the total sum of data amounts output to the ring bus from processing units used for processing does not exceed a maximum amount of data that can be held by the processing modules on the ring bus.Type: ApplicationFiled: April 28, 2010Publication date: November 4, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Daiji Kirihata, Hisashi Ishikawa, Hirowo Inoue, Isao Sakamoto
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Publication number: 20100217904Abstract: An information processing apparatus includes a plurality of modules connected in a ring shape via a bus, and each module processes a packet flowing in a single direction on the ring in a predetermined order. The module includes a communication unit for transmitting a packet received from a first direction in the ring via the bus to a second direction, a discrimination unit for discriminating a packet from among the packets received from the first direction as a processing packet to be processed by the module, and a processing unit which is connected with the communication unit one by one and configured to process the processing packet. The communication unit transmits the packet processed by the processing unit at an interval equivalent to processing time or more for a processing packet processed by a module in a latter stage in the predetermined order among packets transmitted by the communication unit to the second direction.Type: ApplicationFiled: February 19, 2010Publication date: August 26, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa
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Publication number: 20090008432Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.Type: ApplicationFiled: March 22, 2006Publication date: January 8, 2009Applicant: TAMURA CORPORATIONInventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Isao Sakamoto, Masaru Shirai
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Patent number: 7350686Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.Type: GrantFiled: December 13, 2002Date of Patent: April 1, 2008Assignees: Tamura Corporation, Japan Science and Technology AgencyInventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Andou, Isao Sakamoto, Masaru Shirai, Yuji Ohashi
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Publication number: 20080035710Abstract: [Problem to be Solved] [Solution] A solder composition 10 is for forming a solder layer on an electrode 21 provided on a substrate 20. The solder composition 10 includes solder powder composed of a plurality of solder particles 12 coated with organic films 11, and a medium 13 having a boiling point not lower than the melting point of the solder powder. The solder layer on the electrode 21 grows by coalescence of the solder particles 12 with the solder layer. Therefore, when the coalescence of the solder particles proceeds and the amount of the organic film per unit surface area of the solder layer reaches a certain level, the growth of the solder layer stops. Namely, the final solder amount of the solder layer is determined depending on the initial size of the solder particle 12 and amount of the organic film 11. Thereby, it is possible to inhibit coalescence of the solder particles 12 on the electrode 21 beyond necessity, so a short-circuit failure of the electrode 21 can be prevented.Type: ApplicationFiled: August 8, 2005Publication date: February 14, 2008Applicant: TAMURA CORPORATIONInventors: Masahiko Furuno, Hiroshi Saito, Isao Sakamoto, Masaru Shirai
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Patent number: 7304478Abstract: A MRI apparatus includes a super-conducting magnet including a superconducting coil circuit having a super-conducting coil and a permanent current switch for controlling permanent current flowing through the super-conducting coil; at least one electrical circuit which is electrically connected to at least one electrical element and disposed at the outside of the super-conducting magnet; a gradient magnetic filed generating means; a high frequency magnetic field generating means; and shielded examination room which accommodates the super-conducting magnet. The apparatus further comprises means for interrupting noise current generated based on tomographic image measurement of the subject. Said means is disposed outside the super-conducting magnet and inside the shielded examination room while being inserted between the electrical circuit and the super-conducting magnet.Type: GrantFiled: September 12, 2003Date of Patent: December 4, 2007Assignee: Hitachi Medical CorporationInventors: Munetaka Tsuda, Hiroyuki Takeuchi, Isao Sakamoto
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Publication number: 20070181218Abstract: A solder composition capable of in the bump formation on a substrate, simplifying the coating operation. There is provided solder composition (10) comprising a mixture of liquid substance (12) and solder particles (11), wherein the liquid substance (12) contains a flux component of organic acid whose reaction temperature for oxide film removal is in the vicinity of the melting point of the solder particles and has such a viscosity that the liquid substance flows at ordinary temperature and accumulates in the form of a layer on substrate (20). The solder particles (11) consist of a particulate agent that settles in the liquid substance (12) toward a solder base material, having a particle diameter and mixing ratio enabling uniform dispersion in the liquid substance (12).Type: ApplicationFiled: March 17, 2005Publication date: August 9, 2007Applicants: TAMURA CORPORATION, JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Isao Sakamoto, Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Ando, Masaru Shirai, Atsushi Hiratsuka
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Publication number: 20070158387Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.Type: ApplicationFiled: March 29, 2005Publication date: July 12, 2007Applicants: TAMURA CORPORATION, JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Masaru Shirai, Junichi Onozaki, Hiroshi Saito, Isao Sakamoto, Masahiko Furuno, Haruhiko Ando, Atsushi Hiratsuka
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Publication number: 20060054667Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid (13) in a liquid tank (11), a substrate (20) is positioned with a surface (21) facing up. Subsequently, the inert liquid (13) containing solder fine particles (14) is fed from a solder fine particle forming unit (15) to the liquid tank (11) and the solder fine particles (14) are dropped from a supply pipe (16) onto the substrate (20) in the inert liquid (13). The solder fine particles (14) naturally fall down by the gravity, thereby reaching the substrate (20). The solder fine particles (14) reached on the pad electrodes on the substrate (20) stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.Type: ApplicationFiled: December 13, 2002Publication date: March 16, 2006Applicants: Tamura Corporation, Japan Science and Technology AgencyInventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Andou, Isao Sakamoto, Masaru Shirai, Yuji Ohashi
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Publication number: 20050248350Abstract: In order to provide a high intensity magnetic field open type MRI apparatus which suppresses electro-magnetic interference to super-conducting coils due to gradient magnetic field coils and high frequency magnetic field coils and to realize stable operation of super-conducting magnet, in a static magnetic field generating magnet 102, a pair of cryostats 117 are connected by a coupling tube 201 and disposed in vertical direction while sandwiching a space 118 where a subject is laid, and in vessels 202 and 203 filled with liquid helium in the respective cryostats super-conducting coils are accommodated. To the cryostats 117 an emergency demagnetizing unit 120 for attenuating magnetic field and a measurement unit 121 for monitoring helium liquid level belong, and signal cables therefor are connected to an inner circuit of the static magnetic field generating magnet 102 via a filter circuit 122.Type: ApplicationFiled: September 12, 2003Publication date: November 10, 2005Applicant: Hitachi Medical CorporationInventors: Munetaka Tsuda, Hiroyuki Takeuchi, Isao Sakamoto
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Patent number: 4980627Abstract: A numerically controlled apparatus wherein a tool can be returned by a high speed retrograding operation without damaging a chip of a tool or a work. The numerically controlled apparatus comprises a command executing block which decodes a working program for each of block commands and controls controlling driving of a tool to work a work. A retrograde command storage block extracts data necessary for the production of a retrograde block command from the working program and stores the extracted data therein. Upon reception of a retrograding signal, an escapement command producing block produces an escapement block command, and a retrograde block command producing means produces a retrograde block command. Then, an escapement/retrograde command execution controlling block causes the command executing block to execute the escapement block command and the retrograde block command.Type: GrantFiled: March 27, 1990Date of Patent: December 25, 1990Assignees: Mitsubishi Denki Kabushiki Kaisha, Nippei Toyama CorporationInventors: Nobuaki Joboji, Isao Sakamoto, Kouichi Ishikawa, Makoto Konno, Kazuo Imanishi
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Patent number: 4356402Abstract: An engine generator power supply system comprises a plurality of engine generators; a plurality of separate power feed lines for independently feeding power from respective engine generators to a plurality of loads respectively associated with the separate power feed lines; an electromagnetic contactor inserted in each of the power feed lines, the contactor being normally enabled for feeding power to the plurality of loads from one of the engine generators; and a controller for controlling such that the supply of power from a first engine generator to the plurality of loads is switched to the supply of power from a second engine generator to the plurality of loads at a predetermined time interval.Type: GrantFiled: May 28, 1981Date of Patent: October 26, 1982Assignee: Nippon Electric Co., Ltd.Inventors: Izumi Morimoto, Isao Sakamoto
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Patent number: 4198793Abstract: The method of affixing a bolt in a hole in foundations formed of materials such as concrete, stone or rock, wood and the like which includes inserting a bolt in said hole, filling the space surrounding said bolt with a plurality of balls, pouring a liquid curable resin into the hole to fill the interstices between the balls and then curing the resin and the resulting structure.Type: GrantFiled: August 15, 1978Date of Patent: April 22, 1980Assignee: Nippon Jikkou Kabushiki KaishaInventors: Takeshi Sato, Isao Sakamoto, Katsuaki Okamoto, Hiroji Tada