Patents by Inventor Isao Sakamoto

Isao Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100329267
    Abstract: A data processing apparatus includes an input unit to input data and processing modules. The processing modules may be connected as part of a ring-shaped data transfer path to transfer data in one direction. Each processing module includes a communication unit configured to implement a first data processing path and a setting path and a processing unit configured to process data received by the communication unit. When using switching data to switch the processing modules performing on the first data processing path to the processing modules performing on the setting path, the switching data is processed on the first data processing path.
    Type: Application
    Filed: June 15, 2010
    Publication date: December 30, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Isao Sakamoto, Hisashi Ishikawa
  • Publication number: 20100329261
    Abstract: An apparatus, in which a plurality of modules is connected with each other and processes a packet having information, includes a storage unit for storing first information indicating an order of processing performed by its own module and second information indicating an order of modules which perform processing, a reception unit for receiving a first packet and transmitting the first packet including information corresponding to the first information, a processing unit for processing data included in the first packet, a generation unit for generating a second packet including the processed data and the second information, and a transmission unit for comparing the information included in the first packet with the second information included in the second packet, and transmitting the packet having a latter processing order.
    Type: Application
    Filed: June 23, 2010
    Publication date: December 30, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Isao Sakamoto, Hisashi Ishikawa
  • Publication number: 20100281237
    Abstract: In an information processing apparatus in which data processing is performed in a predetermined sequence by processing modules connected to a ring bus, if an amount of data generated by input data in the ring bus is not considered, the data amount exceeds an amount of data that can be held by the processing modules on the ring bus, and a data collision often occurs, so that processing efficiency of the ring bus deteriorates. An amount of data input into the ring bus is controlled so that the total sum of data amounts output to the ring bus from processing units used for processing does not exceed a maximum amount of data that can be held by the processing modules on the ring bus.
    Type: Application
    Filed: April 28, 2010
    Publication date: November 4, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Daiji Kirihata, Hisashi Ishikawa, Hirowo Inoue, Isao Sakamoto
  • Publication number: 20100217904
    Abstract: An information processing apparatus includes a plurality of modules connected in a ring shape via a bus, and each module processes a packet flowing in a single direction on the ring in a predetermined order. The module includes a communication unit for transmitting a packet received from a first direction in the ring via the bus to a second direction, a discrimination unit for discriminating a packet from among the packets received from the first direction as a processing packet to be processed by the module, and a processing unit which is connected with the communication unit one by one and configured to process the processing packet. The communication unit transmits the packet processed by the processing unit at an interval equivalent to processing time or more for a processing packet processed by a module in a latter stage in the predetermined order among packets transmitted by the communication unit to the second direction.
    Type: Application
    Filed: February 19, 2010
    Publication date: August 26, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Isao Sakamoto, Hisashi Ishikawa
  • Publication number: 20090008432
    Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.
    Type: Application
    Filed: March 22, 2006
    Publication date: January 8, 2009
    Applicant: TAMURA CORPORATION
    Inventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Isao Sakamoto, Masaru Shirai
  • Patent number: 7350686
    Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: April 1, 2008
    Assignees: Tamura Corporation, Japan Science and Technology Agency
    Inventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Andou, Isao Sakamoto, Masaru Shirai, Yuji Ohashi
  • Publication number: 20080035710
    Abstract: [Problem to be Solved] [Solution] A solder composition 10 is for forming a solder layer on an electrode 21 provided on a substrate 20. The solder composition 10 includes solder powder composed of a plurality of solder particles 12 coated with organic films 11, and a medium 13 having a boiling point not lower than the melting point of the solder powder. The solder layer on the electrode 21 grows by coalescence of the solder particles 12 with the solder layer. Therefore, when the coalescence of the solder particles proceeds and the amount of the organic film per unit surface area of the solder layer reaches a certain level, the growth of the solder layer stops. Namely, the final solder amount of the solder layer is determined depending on the initial size of the solder particle 12 and amount of the organic film 11. Thereby, it is possible to inhibit coalescence of the solder particles 12 on the electrode 21 beyond necessity, so a short-circuit failure of the electrode 21 can be prevented.
    Type: Application
    Filed: August 8, 2005
    Publication date: February 14, 2008
    Applicant: TAMURA CORPORATION
    Inventors: Masahiko Furuno, Hiroshi Saito, Isao Sakamoto, Masaru Shirai
  • Patent number: 7304478
    Abstract: A MRI apparatus includes a super-conducting magnet including a superconducting coil circuit having a super-conducting coil and a permanent current switch for controlling permanent current flowing through the super-conducting coil; at least one electrical circuit which is electrically connected to at least one electrical element and disposed at the outside of the super-conducting magnet; a gradient magnetic filed generating means; a high frequency magnetic field generating means; and shielded examination room which accommodates the super-conducting magnet. The apparatus further comprises means for interrupting noise current generated based on tomographic image measurement of the subject. Said means is disposed outside the super-conducting magnet and inside the shielded examination room while being inserted between the electrical circuit and the super-conducting magnet.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: December 4, 2007
    Assignee: Hitachi Medical Corporation
    Inventors: Munetaka Tsuda, Hiroyuki Takeuchi, Isao Sakamoto
  • Publication number: 20070181218
    Abstract: A solder composition capable of in the bump formation on a substrate, simplifying the coating operation. There is provided solder composition (10) comprising a mixture of liquid substance (12) and solder particles (11), wherein the liquid substance (12) contains a flux component of organic acid whose reaction temperature for oxide film removal is in the vicinity of the melting point of the solder particles and has such a viscosity that the liquid substance flows at ordinary temperature and accumulates in the form of a layer on substrate (20). The solder particles (11) consist of a particulate agent that settles in the liquid substance (12) toward a solder base material, having a particle diameter and mixing ratio enabling uniform dispersion in the liquid substance (12).
    Type: Application
    Filed: March 17, 2005
    Publication date: August 9, 2007
    Applicants: TAMURA CORPORATION, JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Isao Sakamoto, Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Ando, Masaru Shirai, Atsushi Hiratsuka
  • Publication number: 20070158387
    Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.
    Type: Application
    Filed: March 29, 2005
    Publication date: July 12, 2007
    Applicants: TAMURA CORPORATION, JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Masaru Shirai, Junichi Onozaki, Hiroshi Saito, Isao Sakamoto, Masahiko Furuno, Haruhiko Ando, Atsushi Hiratsuka
  • Publication number: 20060054667
    Abstract: Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid (13) in a liquid tank (11), a substrate (20) is positioned with a surface (21) facing up. Subsequently, the inert liquid (13) containing solder fine particles (14) is fed from a solder fine particle forming unit (15) to the liquid tank (11) and the solder fine particles (14) are dropped from a supply pipe (16) onto the substrate (20) in the inert liquid (13). The solder fine particles (14) naturally fall down by the gravity, thereby reaching the substrate (20). The solder fine particles (14) reached on the pad electrodes on the substrate (20) stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.
    Type: Application
    Filed: December 13, 2002
    Publication date: March 16, 2006
    Applicants: Tamura Corporation, Japan Science and Technology Agency
    Inventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Andou, Isao Sakamoto, Masaru Shirai, Yuji Ohashi
  • Publication number: 20050248350
    Abstract: In order to provide a high intensity magnetic field open type MRI apparatus which suppresses electro-magnetic interference to super-conducting coils due to gradient magnetic field coils and high frequency magnetic field coils and to realize stable operation of super-conducting magnet, in a static magnetic field generating magnet 102, a pair of cryostats 117 are connected by a coupling tube 201 and disposed in vertical direction while sandwiching a space 118 where a subject is laid, and in vessels 202 and 203 filled with liquid helium in the respective cryostats super-conducting coils are accommodated. To the cryostats 117 an emergency demagnetizing unit 120 for attenuating magnetic field and a measurement unit 121 for monitoring helium liquid level belong, and signal cables therefor are connected to an inner circuit of the static magnetic field generating magnet 102 via a filter circuit 122.
    Type: Application
    Filed: September 12, 2003
    Publication date: November 10, 2005
    Applicant: Hitachi Medical Corporation
    Inventors: Munetaka Tsuda, Hiroyuki Takeuchi, Isao Sakamoto
  • Patent number: 4980627
    Abstract: A numerically controlled apparatus wherein a tool can be returned by a high speed retrograding operation without damaging a chip of a tool or a work. The numerically controlled apparatus comprises a command executing block which decodes a working program for each of block commands and controls controlling driving of a tool to work a work. A retrograde command storage block extracts data necessary for the production of a retrograde block command from the working program and stores the extracted data therein. Upon reception of a retrograding signal, an escapement command producing block produces an escapement block command, and a retrograde block command producing means produces a retrograde block command. Then, an escapement/retrograde command execution controlling block causes the command executing block to execute the escapement block command and the retrograde block command.
    Type: Grant
    Filed: March 27, 1990
    Date of Patent: December 25, 1990
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Nippei Toyama Corporation
    Inventors: Nobuaki Joboji, Isao Sakamoto, Kouichi Ishikawa, Makoto Konno, Kazuo Imanishi
  • Patent number: 4356402
    Abstract: An engine generator power supply system comprises a plurality of engine generators; a plurality of separate power feed lines for independently feeding power from respective engine generators to a plurality of loads respectively associated with the separate power feed lines; an electromagnetic contactor inserted in each of the power feed lines, the contactor being normally enabled for feeding power to the plurality of loads from one of the engine generators; and a controller for controlling such that the supply of power from a first engine generator to the plurality of loads is switched to the supply of power from a second engine generator to the plurality of loads at a predetermined time interval.
    Type: Grant
    Filed: May 28, 1981
    Date of Patent: October 26, 1982
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Izumi Morimoto, Isao Sakamoto
  • Patent number: 4198793
    Abstract: The method of affixing a bolt in a hole in foundations formed of materials such as concrete, stone or rock, wood and the like which includes inserting a bolt in said hole, filling the space surrounding said bolt with a plurality of balls, pouring a liquid curable resin into the hole to fill the interstices between the balls and then curing the resin and the resulting structure.
    Type: Grant
    Filed: August 15, 1978
    Date of Patent: April 22, 1980
    Assignee: Nippon Jikkou Kabushiki Kaisha
    Inventors: Takeshi Sato, Isao Sakamoto, Katsuaki Okamoto, Hiroji Tada