Patents by Inventor Isao Tsukagoshi

Isao Tsukagoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10186627
    Abstract: The electric conductor connecting member of this invention comprises a metal foil having a roughened surface on at least one main side, and an adhesive layer formed on the roughened surface of the metal foil.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: January 22, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki Fukushima, Isao Tsukagoshi, Takehiro Shimizu
  • Patent number: 10032952
    Abstract: The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: July 24, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki Fukushima, Isao Tsukagoshi, Takehiro Shimizu
  • Patent number: 9660131
    Abstract: The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 23, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki Fukushima, Isao Tsukagoshi, Takehiro Shimizu
  • Publication number: 20150200324
    Abstract: The electric conductor connecting member of this invention comprises a metal foil having a roughened surface on at least one main side, and an adhesive layer formed on the roughened surface of the metal foil.
    Type: Application
    Filed: January 14, 2015
    Publication date: July 16, 2015
    Inventors: Naoki FUKUSHIMA, Isao TSUKAGOSHI, Takehiro SHIMIZU
  • Publication number: 20100294329
    Abstract: The member for conductor connection of the invention is a member for conductor connection having an adhesive layer 3 formed on at least one side of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the side on which the adhesive layer 3 is formed, and the adhesive layer 3 is formed to a substantially uniform thickness along the projections 2.
    Type: Application
    Filed: September 25, 2008
    Publication date: November 25, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki Fukushima, Isao Tsukagoshi
  • Publication number: 20100288328
    Abstract: The conductor-connecting member of the invention is a conductor-connecting member comprising an adhesive layer 3 formed on at least one surface of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the surface on which the adhesive layer 3 is formed, and the adhesive layer 3 fills in the projections 2 so that the surface formed on the side opposite the metal foil 1 is essentially smooth.
    Type: Application
    Filed: September 25, 2008
    Publication date: November 18, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki Fukushima, Isao Tsukagoshi
  • Patent number: 7771559
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: August 10, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20100116314
    Abstract: The electric conductor connecting member of this invention comprises a metal foil having a roughened surface on at least one main side, and an adhesive layer formed on the roughened surface of the metal foil.
    Type: Application
    Filed: November 9, 2009
    Publication date: May 13, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki FUKUSHIMA, Isao TSUKAGOSHI, Takehiro SHIMIZU
  • Publication number: 20100108141
    Abstract: The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.
    Type: Application
    Filed: November 9, 2009
    Publication date: May 6, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki FUKUSHIMA, Isao TSUKAGOSHI, Takehiro SHIMIZU
  • Patent number: 7528488
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: May 5, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20070273342
    Abstract: An electric power supply apparatus includes a distributed power generator such as a gas turbine generator and a power converter such as an inverter apparatus for converting electric power generated by the distributed power generator into AC electric power (alternating-current power) having a required frequency and a required voltage and supplying the AC electric power to a load. The electric power supply apparatus further includes a control unit having output voltage vs. output current characteristics for determining an output voltage corresponding to an output current of the power converter. The output voltage vs. output current characteristics has a first dropping characteristic for causing output electric power of the electric generator to be limited, between a first output current exceeding a power generation capability of the electric generator and a second output current exceeding a power converting capability of the power converter.
    Type: Application
    Filed: May 24, 2007
    Publication date: November 29, 2007
    Applicants: EBARA CORPORATION, EBARA DENSAN LTD.
    Inventors: Tadashi Kataoka, Shigeru Sakata, Takahide Ozawa, Isao Tsukagoshi, Zheng Dai
  • Patent number: 7258918
    Abstract: An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: August 21, 2007
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20070148985
    Abstract: A porous low-k film, a sacrificial film that can be dissolved in a pure water, an antireflection film and a resist film are successively formed on a dielectric film on a wafer and subsequently exposing the resist film to light in a prescribed pattern and developing the resist film so as to form a prescribed circuit pattern in the resist film. Then, the wafer W is etched so as to form a via hole in the porous low-k film, followed by processing the wafer with a hydrogen peroxide solution so as to denature the resist film. Further, the sacrificial film is dissolved in a pure water so as to strip the resist film and the antireflection film from the water. As a result, a via hole excellent in the accuracy of the shape is formed without doing damage to the dielectric film.
    Type: Application
    Filed: January 3, 2007
    Publication date: June 28, 2007
    Inventors: Nobutaka Mizutani, Fitrianto ., Isao Tsukagoshi, Keizo Hirose, Satohiko Hoshino
  • Patent number: 7176142
    Abstract: A porous low-k film, a sacrificial film that can be dissolved in a pure water, an antireflection film and a resist film are successively formed on a dielectric film on a wafer and subsequently exposing the resist film to light in a prescribed pattern and developing the resist film so as to form a prescribed circuit pattern in the resist film. Then, the wafer W is etched so as to form a via hole in the porous low-k film, followed by processing the wafer with a hydrogen peroxide solution so as to denature the resist film. Further, the sacrificial film is dissolved in a pure water so as to strip the resist film and the antireflection film from the water. As a result, a via hole excellent in the accuracy of the shape is formed without doing damage to the dielectric film.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: February 13, 2007
    Assignee: Tokyo Electron Limited
    Inventors: Nobutaka Mizutani, Fitrianto, Isao Tsukagoshi, Keizo Hirose, Satohiko Hoshino
  • Publication number: 20060263599
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20060260744
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Patent number: 6841022
    Abstract: An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: January 11, 2005
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Isao Tsukagoshi, Kouji Kobayashi, Kazuya Matsuda, Naoki Fukushima, Jyunichi Koide
  • Patent number: 6818086
    Abstract: The present invention is to provide a method for removing adhesive in a short time without requiring any solvent, a repair of which has conventionally been required for a long time, and there is provided a method for repairing a circuit connection part where circuit members having a large number of opposed circuits are connected electrically through an adhesive, wherein mutual joints at a circuit connection part requiring repair are separated, a basic material for transfer is bonded through a transfer adhesive for transfer to at least one circuit member where the adhesive remains and then the adhesive remaining on the circuit member and the transfer adhesive are removed from the circuit member along with the basic material for transfer.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: November 16, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Motohiro Arifuku, Hiroshi Yasuda, Itsuo Watanabe, Kouji Kobayashi, Isao Tsukagoshi
  • Publication number: 20040002214
    Abstract: A porous low-k film, a sacrificial film that can be dissolved in a pure water, an antireflection film and a resist film are successively formed on a dielectric film on a wafer and subsequently exposing the resist film to light in a prescribed pattern and developing the resist film so as to form a prescribed circuit pattern in the resist film. Then, the wafer W is etched so as to form a via hole in the porous low-k film, followed by processing the wafer with a hydrogen peroxide solution so as to denature the resist film. Further, the sacrificial film is dissolved in a pure water so as to strip the resist film and the antireflection film from the water. As a result, a via hole excellent in the accuracy of the shape is formed without doing damage to the dielectric film.
    Type: Application
    Filed: June 6, 2003
    Publication date: January 1, 2004
    Inventors: Nobutaka Mizutani, Fitrianto, Isao Tsukagoshi, Keizo Hirose, Satohiko Hoshino
  • Publication number: 20030178138
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): 1
    Type: Application
    Filed: January 16, 2003
    Publication date: September 25, 2003
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera