Abstract: A semiconductor chip (6,7) is connected to a metal pattern (5). A shear drop surface (15) of an electrode (9) is bonded to the metal pattern (5). A burr (20) is formed at an end portion of the burr surface (16) of the electrode (9). A crushing amount of the end portion of the burr surface (16) is equal to or less than 10 ?m.

Abstract: It is an object of the present invention to provide a semiconductor device which allows an increase in the number of semiconductor elements mounted in parallel and prevents a shape of an insulating substrate onto which the semiconductor elements are mounted, from being laterally long, and provide a semiconductor module including such semiconductor device. A semiconductor device according to the present invention includes an insulating substrate, a metal pattern which is a continuous piece and is bonded to one main surface of the insulating substrate, and a plurality of switching elements which are bonded to a surface opposite to the insulating substrate on the metal pattern, and the plurality of switching elements are arranged in a matrix of two or more rows and two or more columns on the metal pattern.

Abstract: It is an object of the present invention to provide a semiconductor device which allows an increase in the number of semiconductor elements mounted in parallel and prevents a shape of an insulating substrate onto which the semiconductor elements are mounted, from being laterally long, and provide a semiconductor module including such semiconductor device. A semiconductor device according to the present invention includes an insulating substrate, a metal pattern which is a continuous piece and is bonded to one main surface of the insulating substrate, and a plurality of switching elements which are bonded to a surface opposite to the insulating substrate on the metal pattern, and the plurality of switching elements are arranged in a matrix of two or more rows and two or more columns on the metal pattern.

Abstract: A laser-applied treatment apparatus includes a TEA type laser unit and a flexible link, such as a multi-joint arm assembly, for leading a laser beam emitted from the laser unit to a desired location, such as a part of a person's skin which is affected by dermatophytosis, in any desired orientation. Also provided is a pair of convex and concave lenses in the optical path of the apparatus for narrowing and collimating the laser beam such that it has an energy density suitable for use in treatment, e.g., athlete's foot. In one embodiment, a hand switch is mounted on a hand piece portion of the flexible link, and it controls the operation of the laser unit. Also provided is a foot switch which is operatively associated with the hand switch such that the operation of the first switch is rendered valid as long as the foot switch is kept depressed. Such a double switch structure provides an advantageous safety feature.