Patents by Inventor Isao Washio

Isao Washio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240228740
    Abstract: Provided is a polyamide resin composition that, at high temperatures, suppresses reductions in tensile strength due to the addition of a copper-based heat-resistance stabilizer, and maintains a tensile strength over longer periods of time in a hot environment. The composition includes a polyamide resin and a copper-based heat-resistance stabilizer. The polyamide resin includes: a component unit (a) derived from dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and greater than or equal to 10 mol % and less than 50 mol % of a component unit (b2), which is derived from 1,3-bis(aminomethyl)cyclohexane, with respect to the total number of moles of a component unit (b) derived from diamine. The content of copper included in the copper-based heat-resistance stabilizer is 0.001 parts by mass to 0.050 parts by mass, inclusive, with respect to 100 total parts by mass of the polyamide resin.
    Type: Application
    Filed: March 16, 2022
    Publication date: July 11, 2024
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Haruka DOI, Wataru MAKIGUCHI, Kohei NISHINO, Isao WASHIO
  • Publication number: 20240158633
    Abstract: Provided is a polyamide resin composition that has high electrical resistance in a high temperature range (around 130° C.) and high heat resistance. The polyamide resin composition includes: a polyamide resin that includes a component unit (a) derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid and a component unit (b2) derived from a diamine represented by formula (1); and at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) containing a specific phosphinate compound, a specific bisphosphinate compound, or a polymer of these compounds. In formula (1), n and the two instances of m are each independently 0 or 1, and —X— is a single bond or a divalent group selected from the group consisting of —O—, —S—, —SO2—, —CO—, and —CH2—.
    Type: Application
    Filed: March 18, 2022
    Publication date: May 16, 2024
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Wataru MAKIGUCHI, Haruka DOI, Kohei NISHINO, Isao WASHIO
  • Publication number: 20240141165
    Abstract: Provided is a polyamide resin composition that has a high electrical resistance in a high temperature region (around 130° C.) while having a high heat resistance. This polyamide resin composition comprises polyamide resin that contains a component unit (a) deriving from an aromatic dicarboxylic acid or alicyclic dicarboxylic acid and a component unit (b2) deriving from 1,3-bis(aminomethyl)cyclohexane. The polyamide resin composition further comprises at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) comprising a prescribed phosphinate salt compound or bisphosphinate salt compound or a polymer thereof.
    Type: Application
    Filed: March 16, 2022
    Publication date: May 2, 2024
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Haruka DOI, Wataru MAKIGUCHI, Kohei NISHINO, Isao WASHIO
  • Publication number: 20240132695
    Abstract: Provided is a polyamide resin composition that, at high temperatures, suppresses reductions in tensile strength due to the addition of a copper-based heat-resistance stabilizer, and maintains a tensile strength over longer periods of time in a hot environment. The composition includes a polyamide resin and a copper-based heat-resistance stabilizer. The polyamide resin includes: a component unit (a) derived from dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and greater than or equal to 10 mol % and less than 50 mol % of a component unit (b2), which is derived from 1,3-bis(aminomethyl)cyclohexane, with respect to the total number of moles of a component unit (b) derived from diamine. The content of copper included in the copper-based heat-resistance stabilizer is 0.001 parts by mass to 0.050 parts by mass, inclusive, with respect to 100 total parts by mass of the polyamide resin.
    Type: Application
    Filed: March 15, 2022
    Publication date: April 25, 2024
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Haruka DOI, Wataru MAKIGUCHI, Kohei NISHINO, Isao WASHIO
  • Publication number: 20230203247
    Abstract: Provided is a crystalline polyamide resin that can exhibit a high mechanical strength and electrical resistance in high temperature regions (in the neighborhood of 150° C.). This polyamide resin has the following: a dicarboxylic acid-derived component unit (a) that includes a component unit (a1) derived from terephthalic acid, naphthalenedicarboxylic acid, or cyclohexanedicarboxylic acid, at more than 20 mol % and up to and including 100 mol % with reference to the total number of moles of the dicarboxylic acid-derived component unit (a); and a diamine-derived component unit (b) that contains a component unit (b1) deriving from alkylenediamine having 4-18 carbon atoms and a component unit (b2) deriving from diamine given by formula (1).
    Type: Application
    Filed: July 5, 2021
    Publication date: June 29, 2023
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kohei NISHINO, Toshitaka KOSAKA, Isao WASHIO
  • Patent number: 11673341
    Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (?HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: June 13, 2023
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kohei Nishino, Yohei Hotani, Isao Washio
  • Publication number: 20230145824
    Abstract: A member for electric conduction, comprising a metal member and a resin member that is joined to at least a part of a surface of the metal member, the metal member having a roughness index, which is obtained by dividing a true surface area (m2) measured by a krypton adsorption method by a geometric surface area (m2), of 4.0 or more.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 11, 2023
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kazuki KIMURA, Tomoki TORII, Takahiro TOMINAGA, Kai MORIMOTO, Shinji NAKAJIMA, Isao WASHIO, Nobuyoshi SHIMBORI, Junya SHIMAZAKI, Jingjun ZHANG, Akinori AMANO, Haruka DOI
  • Publication number: 20210101347
    Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (?HR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.
    Type: Application
    Filed: February 15, 2019
    Publication date: April 8, 2021
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Kohei NISHINO, Yohei HOTANI, Isao WASHIO
  • Patent number: 10253182
    Abstract: The problem of the invention is to provide a semi-aromatic polyamide resin composition having high rigidity, exceptional impact resistance, and exceptional zygosity with very little change in hardness associated with heating and cooling, as well as a molded article of this semi-aromatic polyamide resin composition. A semi-aromatic polyamide resin composition containing a semi-aromatic polyamide resin (A), acid-modified polyolefin resin (B), and fibrous filler (C), wherein the resin (A) contains a certain amount or more of terephthalic acid component units relative to the total number of moles of dicarboxylic acid component units, the semi-aromatic polyamide resin composition contains a certain amount or more of the resin (B), the glass transition temperature of the semi-aromatic polyamide resin composition is within a predetermined range, and the Vicat softening point of the resin (B) is within a predetermined range, is used as the semi-aromatic polyamide resin composition in order to solve this problem.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: April 9, 2019
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kaoru Minagawa, Hiroki Ebata, Isao Washio, Kouichi Sano, Nobuhiro Takizawa, Akinori Amano
  • Patent number: 10011715
    Abstract: The purpose of the present invention is to provide a polyester resin with improved mechanical properties, molding performance, and, preferably, fire retardancy. This polyester resin composition contains the following: a polyester resin (A) that has a melting point or glass transition temperature of at least 250° C.; a thermoplastic resin (B) that has an olefin-derived constitutional unit and an aromatic hydrocarbon structure and has an intrinsic viscosity ([?]), as measured in decalin at 135° C., of 0.04 to 1.0 dl/g; and a copolymer (C) that has an olefin-derived constitutional unit, an ?,?-unsaturated-carboxylic-ester-derived constitutional unit, and a cyclic oxy-hydrocarbon structure.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: July 3, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Isao Washio, Hideto Ogasawara, Hiroki Ebata, Fumio Kageyama, Nobuhiro Takizawa, Akinori Amano
  • Patent number: 9932444
    Abstract: To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: April 3, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Isao Washio, Hiroki Ebata, Fumio Kageyama, Toshitaka Kosaka, Hideto Ogasawara, Akinori Amano, Nobuhiro Takizawa
  • Publication number: 20170283556
    Abstract: The present invention relates to a polyamide-based thermoplastic elastomer composition [Y] in which a rubber composition [X] and a phenol resin-based crosslinking agent [IV] are dynamically crosslinked, the rubber composition [X] comprising a polyamide [I] including 30 to 100% by mole of a terephthalic acid structural unit and having a melting point of 220 to 290° C.; an ethylene-?-olefin-unconjugated polyene copolymer rubber [II] including structural units of ethylene, an ?-olefin having 3 to 20 carbon atoms and an unconjugated polyene, respectively; and an olefin-based polymer [III] including 0.3 to 5.0% by mass of a functional group structural unit, (the total of [I] to [IV]: 100% by mass).
    Type: Application
    Filed: December 5, 2014
    Publication date: October 5, 2017
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Hiroki EBATA, Tatsuya ENOMOTO, Isao WASHIO, Fumio KAGEYAMA, Atsushi TAKEISHI, Yuji ISHII, Akinori AMANO
  • Patent number: 9732223
    Abstract: The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: August 15, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Isao Washio, Hiroki Ebata, Hideto Ogasawara, Nobuhiro Takizawa, Fumio Kageyama, Akinori Amano
  • Publication number: 20160312027
    Abstract: The problem of the invention is to provide a semi-aromatic polyamide resin composition having high rigidity, exceptional impact resistance, and exceptional zygosity with very little change in hardness associated with heating and cooling, as well as a molded article of this semi-aromatic polyamide resin composition. A semi-aromatic polyamide resin composition containing a semi-aromatic polyamide resin (A), acid-modified polyolefin resin (B), and fibrous filler (C), wherein the resin (A) contains a certain amount or more of terephthalic acid component units relative to the total number of moles of dicarboxylic acid component units, the semi-aromatic polyamide resin composition contains a certain amount or more of the resin (B), the glass transition temperature of the semi-aromatic polyamide resin composition is within a predetermined range, and the Vicat softening point of the resin (B) is within a predetermined range, is used as the semi-aromatic polyamide resin composition in order to solve this problem.
    Type: Application
    Filed: December 19, 2014
    Publication date: October 27, 2016
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Kaoru MINAGAWA, Hiroki EBATA, Isao WASHIO, Kouichi SANO, Nobuhiro TAKIZAWA, Akinori AMANO
  • Publication number: 20160168381
    Abstract: The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.
    Type: Application
    Filed: July 25, 2014
    Publication date: June 16, 2016
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Isao WASHIO, Hiroki EBATA, Hideto OGASAWARA, Nobuhiro TAKIZAWA, Fumio KAGEYAMA, Akinori AMANO
  • Publication number: 20160090482
    Abstract: The present invention is directed to a polyester resin composition for providing a reflector having excellent mechanical strength and heat resistance, maintaining high reflectance even in a heated environment such as an LED manufacturing process or a reflow soldering process, and having small change in shrinkage rate. The polyester resin composition for a reflective material is a composition comprising 30 to 80% by mass of a polyester resin (A) with a melting point or a glass transition temperature of 250° C. or more, 10 to 35% by mass of a glass fiber (B) with a minor axis of 3 to 8 ?m, 5 to 50% by mass of a white pigment (C), and 0.3 to 1.5% by mass of an olefin polymer (D) containing 0.2 to 1.8% of a functional group structural unit (all based on a total of (A), (B), (C) and (D) which is 100% by mass).
    Type: Application
    Filed: May 9, 2014
    Publication date: March 31, 2016
    Applicant: MITSUI CHEMICALS., INC.
    Inventors: Hiroki EBATA, Hideto OGASAWARA, Isao WASHIO, Fumio KAGEYAMA, Nobuhiro TAKIZAWA, Akinori AMANO, Takashi HAMA
  • Publication number: 20150329670
    Abstract: To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.
    Type: Application
    Filed: November 12, 2013
    Publication date: November 19, 2015
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Isao WASHIO, Hiroki EBATA, Fumio KAGEYAMA, Toshitaka KOSAKA, Hideto OGASAWARA, Akinori AMANO, Nobuhiro TAKIZAWA
  • Publication number: 20150274964
    Abstract: The purpose of the present invention is to provide a polyester resin with improved mechanical properties, molding performance, and, preferably, fire retardancy. This polyester resin composition contains the following: a polyester resin (A) that has a melting point or glass transition temperature of at least 250° C.; a thermoplastic resin (B) that has an olefin-derived constitutional unit and an aromatic hydrocarbon structure and has an intrinsic viscosity ([?]), as measured in decalin at 135° C., of 0.04 to 1.0 dl/g; and a copolymer (C) that has an olefin-derived constitutional unit, an ?,?-unsaturated-carboxylic-ester-derived constitutional unit, and a cyclic oxy-hydrocarbon structure.
    Type: Application
    Filed: November 19, 2013
    Publication date: October 1, 2015
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Isao Washio, Hideto Ogasawara, Hiroki Ebata, Fumio Kageyama, Nobuhiro Takizawa, Akinori Amano
  • Patent number: 6319878
    Abstract: A thermosensitive recording medium capable of forming a visible image thereon when subjected to thermal printing, which has a transparent support, a thermosensitive recording layer provided on the transparent support, containing a dye and a color developer capable of inducing a color in the dye upon the application of heat thereto in the course of the thermal printing, and a mat layer, containing a granular thermosensitive recording layer, containing a granular filler and a binder resin, the mat layer having a surface smoothness of 100 to 2000 sec before subjected to the thermal printing, and a portion of the mat layer subjected to the thermal printing having a surface smoothness of 5,000 sec or less at most.
    Type: Grant
    Filed: October 16, 1998
    Date of Patent: November 20, 2001
    Assignee: Ricoh Company, Ltd.
    Inventors: Hiroyuki Ina, Ryohichi Kitajima, Isao Washio, Shinji Okada, Motoo Tasaka