Patents by Inventor Isaura S. Gaeta

Isaura S. Gaeta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for cutting a wafer
    Patent number: 6357330
    Abstract: A wafer cutting apparatus which includes a wafer saw, a detector, and a control unit. The detector detects a variable of a wafer being sawed. The control unit utilizes the variable to control the saw.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: March 19, 2002
    Assignee: Intel Corporation
    Inventors: M. Lawrence A. Dass, Isaura S. Gaeta, Krishna Seshan