Patents by Inventor Ishfaqur Raza

Ishfaqur Raza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050138302
    Abstract: Some embodiments of the invention maintain a high degree of overall logic analysis and debug capabilities while simultaneously enabling the reduction of logic analyzer design complexity. Other embodiments of the invention provide a logical analyzer interface (LAI) mode of operation to memory module buffers by adding additional LAI features to the silicon designed to also operate in a normal mode. Other embodiments of the invention are described in the claims.
    Type: Application
    Filed: December 23, 2003
    Publication date: June 23, 2005
    Applicant: Intel Corporation (a Delaware corporation)
    Inventors: John Lusk, Richard Glass, Ishfaqur Raza
  • Patent number: 6366472
    Abstract: An apparatus and method for inhibiting EMI leakage is disclosed. In one embodiment of the present invention, an enclosure for surrounding an EMI producing device has protrusions extending from an edge of the enclosure. The protrusions are insertable into a printed circuit board to make contact with a grounding layer in the printed circuit board. In another embodiment, the enclosure is mateable with an EMI containment box, such as a Faraday cage, to fully enclose an EMI producing device.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: April 2, 2002
    Assignee: Intel Corporation
    Inventors: Joseph S. Alina, Nadir Sharaf, Ishfaqur Raza
  • Publication number: 20010002877
    Abstract: An apparatus and method for inhibiting EMI leakage is disclosed. In one embodiment of the present invention, an enclosure for surrounding an EMI producing device has protrusions extending from an edge of the enclosure. The protrusions are insertable into a printed circuit board to make contact with a grounding layer in the printed circuit board. In another embodiment, the enclosure is mateable with an EMI containment box, such as a Faraday cage, to fully enclose an EMI producing device.
    Type: Application
    Filed: November 29, 1999
    Publication date: June 7, 2001
    Inventors: JOSEPH S. ALINA, NADIR SHARAF, ISHFAQUR RAZA
  • Patent number: 6205026
    Abstract: An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: March 20, 2001
    Assignee: Intel Corporation
    Inventors: Thomas J. Wong, Neal Ulen, Ketan R. Shah, Ishfaqur Raza