Abstract: A method is disclosed for implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform. A method is also disclosed for implementing the configured thermal management control. In a run-time environment for a computing platform a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementations and examples are also described in this disclosure.

Abstract: A method is disclosed for implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform. A method is also disclosed for implementing the configured thermal management control. In a run-time environment for a computing platform a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementations and examples are also described in this disclosure.

Abstract: A method is disclosed for implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform. A method is also disclosed for implementing the configured thermal management control. In a run-time environment for a computing platform a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementations and examples are also described in this disclosure.

Abstract: For one disclosed embodiment, a lower limit for a power consumption device may be identified. Performance of the power consumption device may be reduced in response to a determination that a temperature corresponding to the power consumption device exceeds a threshold. Performance reduction may be limited based on the lower limit. Other embodiments are also disclosed.

Abstract: Methods and apparatuses for intervening in the self power or thermal regulations of a plurality of independent power consumption devices are described herein. The novel methods may include monitoring power consumption and thermal conditions of the plurality of power consumption (i.e., power/heat dissipation) devices that are configured to independently self-regulate their power/thermal production. A determination may then be made as to whether an aggregate of the power and/or thermal production of the plurality of power consumption devices exceed a threshold. And if the aggregate of the power or thermal production of the power consumption devices was determined to exceed the threshold, terminating, at least partially, the independent self-regulating of the thermal production and intervening in the thermal regulation of one or more of the power consumption devices.

Abstract: A method is disclosed for implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform. A method is also disclosed for implementing the configured thermal management control. In a run-time environment for a computing platform a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementations and examples are also described in this disclosure.

Abstract: Methods and apparatuses for intervening in the self power or thermal regulations of a plurality of independent power consumption devices are described herein. The novel methods may include monitoring power consumption and thermal conditions of the plurality of power consumption (i.e., power/heat dissipation) devices that are configured to independently self-regulate their power/thermal production. A determination may then be made as to whether an aggregate of the power and/or thermal production of the plurality of power consumption devices exceed a threshold. And if the aggregate of the power or thermal production of the power consumption devices was determined to exceed the threshold, terminating, at least partially, the independent self-regulating of the thermal production and intervening in the thermal regulation of one or more of the power consumption devices.

Abstract: A method is disclosed for implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform. A method is also disclosed for implementing the configured thermal management control. In a run-time environment for a computing platform a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementations and examples are also described in this disclosure.

Abstract: Methods and apparatuses for intervening in the self power or thermal regulations of a plurality of independent power consumption devices are described herein. The novel methods may include monitoring power consumption and thermal conditions of the plurality of power consumption (i.e., power/heat dissipation) devices that are configured to independently self-regulate their power/thermal production. A determination may then be made as to whether an aggregate of the power and/or thermal production of the plurality of power consumption devices exceed a threshold. And if the aggregate of the power or thermal production of the power consumption devices was determined to exceed the threshold, terminating, at least partially, the independent self-regulating of the thermal production and intervening in the thermal regulation of one or more of the power consumption devices.

Abstract: Systems and methods of conducting thermal management provide for transmitting average power data to a source device, where the source device has a thermal influence on a target device and the average power data is based on the thermal influence. Adjustable time window data may also be transmitted to the source device, where the time window defines the amount of time for determining and controlling the average power consumption of the source device.

Abstract: A method is disclosed for implementing a scheme to configure thermal management control for a memory device resident on a memory module for a computing platform. A method is also disclosed for implementing the configured thermal management control. In a run-time environment for a computing platform a temperature is obtained from a thermal sensor monitoring the memory module. The memory module is in a given memory module with thermal sensor configuration that includes the memory device. An approximation of a temperature for the memory device is made based on thermal information associated with the given configuration of the memory module and the obtained temperature. The configured thermal management control for the memory device is implemented based on the approximated temperature. Other implementations and examples are also described in this disclosure.

Abstract: A method and system are described for thermal management using power density feedback. The system may include one or more regions of the system, where the system includes one or more dies; and a thermal relationship coefficient to describe a thermal relationship between the one or more regions. In some embodiments, the embodiments of the method may include measuring the activity of one or more regions, and using the thermal relationships to determine an activity configuration for the system or parts thereof. In some embodiments, the activity configuration may be applied to the one or more regions. Other embodiments may be described.

Abstract: Systems and methods of conducting thermal management provide for transmitting average power data to a source device, where the source device has a thermal influence on a target device and the average power data is based on the thermal influence. Adjustable time window data may also be transmitted to the source device, where the time window defines the amount of time for determining and controlling the average power consumption of the source device.