Patents by Inventor Isikawa Hideki

Isikawa Hideki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11060771
    Abstract: According to an embodiment of the present disclosure, an air conditioner includes an outdoor heat exchanger disposed in an outdoor unit and an indoor heat exchanger disposed in an indoor unit. The air conditioner also includes a refrigerant pipe configured to connect the outdoor heat exchanger and the indoor heat exchanger. The air conditioner also includes and a refrigerant ratio adjusting device configured adjust a ratio between a liquid refrigerant and a gaseous refrigerant passing through the refrigerant pipe.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: July 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Aono Masahiro, Takeichi Hisashi, Isikawa Hideki, Kaneko Takashi, Ogasawara Tetsuya
  • Publication number: 20180112899
    Abstract: According to an embodiment of the present disclosure, an air conditioner includes an outdoor heat exchanger disposed in an outdoor unit and an indoor heat exchanger disposed in an indoor unit. The air conditioner also includes a refrigerant pipe configured to connect the outdoor heat exchanger and the indoor heat exchanger. The air conditioner also includes and a refrigerant ratio adjusting device configured adjust a ratio between a liquid refrigerant and a gaseous refrigerant passing through the refrigerant pipe.
    Type: Application
    Filed: October 25, 2017
    Publication date: April 26, 2018
    Inventors: Aono Masahiro, Takeichi Hisashi, Isikawa Hideki, Kaneko Takashi, Ogasawara Tetsuya