Abstract: The invention relates to the technical field of plasma treatment of planar elements such as plates, sheets and wafers in electronics and electrical engineering, and in essence is a device for treating wafers with a plasma jet. The device comprises the following elements mounted in a closed chamber: a drive that effects angular displacement of the holders, which are provided with a common rotary drive, a plasma jet generator, and, mounted outside the closed chamber a manipulator and storage devices for the wafers. The wafer to be treated is picked up by the manipulator from the storage device and placed in the holder which together with the wafer passes over the plasma jet generator used for the treatment. The cycle may be repeated a predetermined number of times.