Abstract: A printed circuit is made by laser projection patterning a metal panel of a substrate, laminating a dielectric layer on the metal panel, laser irradiating the substrate to form vias in the substrate, laser activating a seed coat on the substrate, washing the seed coat from an unpatterned portion of the substrate, forming a patterned build-up layer on the substrate, and etching away a metal plating forming metal protrusions.

Abstract: A printed circuit is made with a via-defining substrate including a microelectronic substrate defining via openings therein. Interconnects are provided on the via-defining substrate according to a predetermined interconnect pattern. The interconnects include a conductive layer having a pattern corresponding to the predetermined interconnect pattern. The conductive layer further being made substantially from a first material. The conductive layer further including a second material that is different from the first material. The second material including a metallic seeding material and is present on the via-defining substrate only at regions corresponding to the interconnects. The interconnects are formed by catalyzing the conductive layer with an activator layer to electrolessly plate the via-defining substrate with the first material.

Abstract: According to some embodiments, a process, an apparatus, and a system are provided. In some embodiments, the process includes reflowing solder located in an opening formed through both a solder resist material disposed on a substrate and a mask material disposed on top of the solder resist material; and removing the mask material after reflowing of the solder.

Abstract: A method includes generating a laser beam and applying the beam to a substrate to form a via in the substrate. The laser beam has an intensity profile taken at a cross-section transverse to the direction of propagation of the beam. The intensity profile has a first substantially uniform level across an interior region of the cross-section and a second substantially uniform level across an exterior region of the cross-section. The second intensity level is greater than the first intensity level.

Abstract: A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via openings in the substrate using laser irradiation; providing a laser activatable film on the via-defining substrate; and providing interconnects on the via-defining substrate. Providing interconnects comprises providing a patterned build-up layer on the via-defining substrate comprising exposing the laser activatable film to laser irradiation to selectively activate portions of the film according to a predetermined interconnect pattern; and metallizing the patterned build-up layer according to the predetermined interconnect pattern to yield the interconnects to provide the printed circuit board.

Abstract: An embodiment of the present invention is a technique to ablate patterns using laser patterning. A mask structure having features corresponding to first and second patterns receives an incident laser beam at a wavelength. A substrate panel is irradiated by the incident laser beam through the mask structure to have the first and second patterns ablated to first and second depths, respectively, such that a difference between the first and second depths is compensated according to an absorptivity of the mask structure. Hence, the first and the second patterns are ablated simultaneously.

Abstract: A microelectronic inductor, a method of fabricating the inductor, and a system incorporating the inductor. The inductor comprises a pair of supporting layers; a high inductance soft magnetic core disposed between the supporting layers; and conductive windings provided about the magnetic core, the windings including a system of interconnected conductive vias and conductive traces, the vias extending through the supporting layers and the magnetic core and the conductive traces being disposed to interconnect the vias. The inductor may be discrete or embedded into a substrate by being patterned thereon.

Abstract: A method of fabricating an integrated circuit package, comprising prefabricating a film capacitor including forming a first conductive layer, depositing a dielectric layer on the first conductive layer, and depositing a second conductive layer on the dielectric layer; forming a substrate; and laminating the prefabricated film capacitor to the substrate.

Abstract: An apparatus includes a substrate of ceramic material, and a conductive path associated with the substrate formed by a laser directed at the ceramic material.