Abstract: The invention relates to a heat dissipation device comprising a support (10) and a heat sink (12) designed to be cooled by an air flow passing through the sink (12), the support (10) having a first housing inside which the sink (10) is held, the support (10) being further configured to accommodate an electronic control module (2) designed to be cooled by the sink (12).

Abstract: Embodiments disclosed herein include sockets and socket architectures. In an embodiment, a socket comprises a substrate. In an embodiment, an opening is provided through the substrate. In an embodiment, an elastomeric pin inserted into the opening. In an embodiment, the elastomeric pin is electrically conductive.

Abstract: Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).

Abstract: Methods and apparatus relating to phase heterogeneous interconnects for crosstalk reduction are described. In one embodiment, an interconnect includes a plurality of links. A first set of links from the plurality of links communicates signals and a second set of links from the plurality of links provides a return path. The interconnect also includes one or more links from the first set of links that include one or more structures with a larger diameter than a minimum diameter of the one or more links. The larger diameter modifies an inductance or capacitance of the one or more links to provide a heterogenous phase delay amongst the plurality of links. Other embodiments are also claimed and disclosed.

Abstract: An apparatus and method for adjusting differential impendence of pins in a socket are described. A socket or test system includes a pin assembly that contains a pin block and pins. The pin block is formed from a material having a first permittivity. The pins include differential pin pairs with a fine pitch and provide electrical contact to an electronic package disposed on the pin block. A volume between each pin of the differential pin pairs or between adjacent pin pairs have a second permittivity that is different than the first permittivity. The volume is filled with air or one or more materials (or air) whose combined permittivity reduces or increases the differential impendence.

Abstract: The invention relates to a motorized fan unit for a motor vehicle, comprising a motor (2), a fan (3) for moving an air flow (F) that is configured to be controlled by the motor (2), and a control module (4) for controlling said motor (2), the control module (4) comprising an electronic card, the motorized fan unit delimiting a main air-flow circulation duct (5) and a cooling duct (6) configured to cool said electronic card of the control module, the duct (6) comprising an inlet (7) provided with a deflector (8) for diverting a portion of the air flow into the duct (6), the deflector (8) being mounted movably according to an air flow rate in the main duct for the purpose of increasing an air flow rate in the cooling duct (6) with the speed of the air flow in the main duct (5).

Abstract: The invention relates to a heat sink for an electronic board of a motor vehicle motor-driven fan unit, comprising a surface (2) intended for exchanging heat with an air flow set in motion by the motor-driven fan unit, referred to as exchange surface (2), said exchange surface (2) comprising a planar portion (3) arranged so that, in a position installed in the motor-driven fan unit, the air flow set in motion by the motor-driven fan unit flows substantially parallel to said planar portion (3), the exchange surface (2) also comprising a set of blind recesses (4) flush with said planar portion (3).

Abstract: An apparatus comprising an interconnect comprising a conductive core; a first conductive layer connected to the conductive core and extending parallel to the conductive core towards a first end of the conductive core; a second conductive layer connected to the conductive core and extending parallel to the conductive core towards a second end of the conductive core; a first non-conductive layer between the conductive core and the first conductive layer; and a second non-conductive layer between the first conductive layer and the second conductive layer.

Abstract: The invention relates to an assembly for an electric motor, comprising a motor support (2), a brush (5) and a device for moving (7, 10) the brush (5), the device comprising an arm (7) rigidly connected to the brush (5) and a pivot connector (10) between the support (2) and the arm (7), characterised in that the pivot connector (10) is made from an elastomeric material so as to exert a restoring force on the arm (7).

Abstract: The invention relates to a heat dissipation device comprising a support (10) and a heat sink (12) designed to be cooled by an air flow passing through the sink (12), the support (10) having a first housing inside which the sink (10) is held, the support (10) being further configured to accommodate an electronic control module (2) designed to be cooled by the sink (12).

Abstract: In one embodiment, an interconnect apparatus (e.g., an interposer apparatus) includes a plurality of interconnect probes that each include a wave spring structure that includes a plurality of stacked wave spring discs. The wave spring discs may be formed in a sinusoidal wave form shape, or in another wave form shape.

Abstract: The invention concerns the transmission of synchronous data between a master communication module and a slave communication module via a serial data bus, in particular a SPI bus. According to the invention, the data to be transmitted by each of the two master and slave communication modules are encapsulated in a data field (31) of at least one frame further comprising a frame identifier (30), and two frames are exchanged simultaneously between the two master and slave communication modules according to at least one predefined sequencing corresponding to a unique pairing of the identifiers of the two frames exchanged simultaneously. The integrity of a communication can therefore be controlled by verifying the sequencing of the exchanged frames.

Abstract: The invention concerns the transmission of synchronous data between a master communication module and a slave communication module via a serial data bus, in particular a SPI bus. According to the invention, the data to be transmitted by each of the two master and slave communication modules are encapsulated in a data field (31) of at least one frame further comprising a frame identifier (30), and two frames are exchanged simultaneously between the two master and slave communication modules according to at least one predefined sequencing corresponding to a unique pairing of the identifiers of the two frames exchanged simultaneously. The integrity of a communication can therefore be controlled by verifying the sequencing of the exchanged frames.