Patents by Inventor Israel Dadon

Israel Dadon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card having dummy traces for testing an integrated circuit to be installed in a multichip-module
    Patent number: 11422155
    Abstract: An apparatus for testing an Integrated Circuit (IC) to be installed on a product substrate of a Multi-Chip Module (MCM) is disclosed. The apparatus includes a test substrate including (i) a first surface configured to receive the tested IC and at least an additional IC, (ii) a second surface that is opposite the first surface and is configured to receive electrical contacts, and (iii) first electrical traces for conveying electrical signals between the tested IC, the additional IC and the electrical contacts. The apparatus further includes a second electrical trace, which is formed in the test substrate instead of the additional IC and is configured to electrically connect between two of the first electrical traces.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: August 23, 2022
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Konstantin Turchin, Israel Dadon, Ido Bourstein
  • Probe Card for Testing a Die to Be Installed in a Multichip-Module
    Publication number: 20200379006
    Abstract: An apparatus for testing an Integrated Circuit (IC) to be installed on a product substrate of a Multi-Chip Module (MCM) is disclosed. The apparatus includes a test substrate including (i) a first surface configured to receive the tested IC and at least an additional IC, (ii) a second surface that is opposite the first surface and is configured to receive electrical contacts, and (iii) first electrical traces for conveying electrical signals between the tested IC, the additional IC and the electrical contacts. The apparatus further includes a second electrical trace, which is formed in the test substrate instead of the additional IC and is configured to electrically connect between two of the first electrical traces.
    Type: Application
    Filed: May 28, 2019
    Publication date: December 3, 2020
    Inventors: Konstantin Turchin, Israel Dadon, Ido Bourstein