Abstract: System for performing in-line nanoprobing on semiconductor wafer. A wafer support or vertical wafer positioner is attached to a wafer stage. An SEM column, an optical microscope and a plurality of nanoprobe positioners are all attached to the ceiling. The nanoprobe positioners have one nanoprobe configured for physically contacting selected points on the wafer. A force (or touch) sensor measures contact force applied by the probe to the wafer (or the moment) when the probe physically contacts the wafer. A plurality of drift sensors are provided for calculating probe vs. wafer alignment drift in real-time during measurements.

Abstract: System for performing in-line nanoprobing on semiconductor wafer. A wafer support or vertical wafer positioner is attached to a wafer stage. An SEM column, an optical microscope and a plurality of nanoprobe positioners are all attached to the ceiling. The nanoprobe positioners have one nanoprobe configured for physically contacting selected points on the wafer. A force (or touch) sensor measures contact force applied by the probe to the wafer (or the moment) when the probe physically contacts the wafer. A plurality of drift sensors are provided for calculating probe vs. wafer alignment drift in real-time during measurements.

Abstract: A method for probing a semiconductor device under test (DUT) using a combination of scanning electron microscope (SEM) and nanoprobes, by: obtaining an SEM image of a region of interest (ROI) in the DUT; obtaining a CAD design image of the ROI; registering the CAD design image with the SEM image to identify contact targets; obtaining a Netlist corresponding to the contact targets and using the Netlist to determine which of the contact targets should be selected as test target; and, navigating nanoprobes to land a nanoprobe on each of the test targets and form electrical contact between the nanoprobe and the respective test target.

Abstract: A collection optics having variable magnification, and which enable changing magnification without stopping the spray cooling. The variable magnification is provided by a turret that carries several objectives of different magnifications. A frame is provided above the turret, wherein the spray cooling is provided. By rotating the turret and changing its elevation, different objectives of the turret can be “docked” to a docking port within the frame.

Abstract: A collection optics having variable magnification, and which enable changing magnification without stopping the spray cooling. The variable magnification is provided by a turret that carries several objectives of different magnifications. A frame is provided above the turret, wherein the spray cooling is provided. By rotating the turret and changing its elevation, different objectives of the turret can be “docked” to a docking port within the frame.

Abstract: A system and method for calibration of a commercial semiconductor test system (tester). The system receives a synchronization signal from the tester and detects light emission from a device under test (DUT). The system then compares the timing and characteristics of the light emission to the synchronization signal to obtain a delay timing and signal change caused by intermediate elements of the tester. The delay timing and signal change are used to calibrate the various channels of the tester. Also described are various designs for DUT's to obtained enhanced accuracy of the delay timing. Further, a system and method are described for reconstruction of a test signal and study of the effects of intermediate elements of the tester on the shape of the test signal.

Abstract: A system and method for calibration of a commercial semiconductor test system (tester). The system receives a synchronization signal from the tester and detects light emission from a device under test (DUT). The system then compares the timing and characteristics of the light emission to the synchronization signal to obtain a delay timing and signal change caused by intermediate elements of the tester. The delay timing and signal change are used to calibrate the various channels of the tester. Also described are various designs for DUT's to obtained enhanced accuracy of the delay timing. Further, a system and method are described for reconstruction of a test signal and study of the effects of intermediate elements of the tester on the shape of the test signal.

Abstract: A system for measuring a topographical feature on a specimen including apparatus for scanning an electron beam across the feature at high speed, first and second electron detector apparatus organized in pairs, apparatus for signal processing of a first signal received from the first electron detector apparatus thereby to identify elements of a cross-sectional profile of the feature, apparatus for signal processing of a second signal received from the second electron detector apparatus generally separately from the signal processing of the first signal thereby to identify elements of a cross-sectional profile of the feature, and apparatus for incorporating the elements identified from the first electron detector apparatus and the elements identified from the second electron detector apparatus thereby to produce a composite picture of the feature.