Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

Abstract: A laser transmitter component including a photonic integrated circuit substrate including a plurality of laser transmitters coupled to at least one optical output, and configured to emit a light beam from one of the laser transmitters of the plurality of laser transmitters through the at least one optical output one laser transmitter at a time; a feedback circuit configured to determine at least one characteristic of the light beam emitted from the optical output and to provide the determined characteristic to a controller; and the controller configured to control at least one of a temperature and an input electrical current of the laser transmitter emitting the light beam and to control at least one of a temperature and an input electrical current of at least one further laser transmitter of the laser transmitter component based on the determined characteristic.

Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Abstract: Technologies for silicon diffraction gratings are disclosed. In some embodiments, grating lines of the diffraction gratings may have several sub-lines that make up each grating line of the diffraction grating. The sub-lines may be sub-wavelength features. In some embodiments, several silicon diffraction gratings may be made from a wafer, such as a wafer with a diameter of 300 millimeters. The wafer may be etched precisely across the entire wafer, leading to a high yield of the diffraction gratings.

Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.

Abstract: A photonic integrated circuit is provided having a plurality of light paths each configured to branch light received from at least one light receiving input to a first light path section and a second light path section, to turn the polarization of at least a portion of the light received at the receiving input into light of a first linear polarization and light of a second linear polarization that is orthogonal to the first polarization; wherein the first light path section is configured to emit light of the first linear polarization to the outside; wherein the second light path section is configured to determine an interference signal using the light having the second linear polarization of the first light path and light having the second received from the outside.

Abstract: A light detection and ranging system is provided having an interlaced angular dispersion by providing a photonic integrated circuit having a plurality of light paths having a non-uniform next-neighbor distance and emitting light of different wavelengths through the light paths.

Abstract: A photonic integrated circuit, comprising a semiconductor photonic substrate having integrated therein: at least one light receiving input; at least one optical splitter to branch light received at the at least one light receiving input to a first light path and a second light path; wherein, the photonic integrated circuit, in the first light path, includes: at least one first amplifier structure to amplify the light in the first light path to provide first amplified light; at least one first light output to output the first amplified light from the at least one first amplifier structure; and at least one first photo detector to receive light from the outside of the photonic integrated circuit, the at least one first photo detector being located next to the at least one first light output; wherein, the photonic integrated circuit, in the second light path, includes: at least one second amplifier structure to amplify the light in the second light path to provide second amplified light; at least one second ligh

Abstract: A light detection and ranging (LIDAR) system, including: a laser source configured to emit one or more optical beams; at least one optical channel configured to emit the one or more optical beams from an optical output interface of the optical channel over a scene and capture reflections of the one or more optical beams from the scene in an optical input interface of the optical channel; wherein the one or more optical beams are scanned in a first direction, and wherein the optical input interface and the optical output interface are arranged along a second direction different from the first direction, and wherein the optical channel comprises a polarization beam displacer configured to guide reflections of the one or more beams from a receiving position arranged along the first direction towards the optical input interface.

Abstract: For example, an apparatus may include a housing including a window; a sensor within the housing, the light-based sensor to generate sensor information based on light of a first configuration received via the window; and a light projector within the housing, the light projector configured to project light of a second configuration onto the window, wherein the light of the second configuration is configured such that the window is to be heated by absorption of the light of the second configuration.

Abstract: A light detection and ranging system including a mounting connection of a lens system in a mounting structure, including a lens system mounted in the mounting structure, the mounting connection including that the mounting structure includes at least one alignment opening, and the lens system includes a mounting shaft configured to mount the lens system in the mounting structure, wherein the alignment opening laterally surrounds the mounting shaft at least in part spaced apart in an alignment distance from the mounting shaft in the predefined alignment condition; and a spacer configured to span at least in part the alignment distance, wherein the mounting shaft is fixed in the alignment condition in the alignment opening by a first connection that fixes the spacer to the mounting structure, and by a second connection that fixes the spacer to the mounting shaft.

Abstract: An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an MEMS device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the MEMS device.

Abstract: Optical apparatus includes a semiconductor substrate and one or more radiation sources, mounted on a surface of the substrate and configured to emit optical radiation. A scanning mirror is mounted on the substrate and is configured to scan the reflected optical radiation over a predetermined angular range in a direction that is angled away from the surface.

Abstract: Aspects of the invention are directed to an electronic device package including an electronic device comprising a first contact point; a metal pad disposed to provide electrical connection to the first contact point; a substrate comprising a first face and a second face opposing the first face of the substrate, the first face of the substrate adjacent a face of the electronic device; and a VIA passing through the substrate from the second face of the substrate to the metal pad, the VIA exhibiting: a pass through extending through the substrate from the first face to the second face; a metal layer disposed within the pass through arranged to provide electrical connectivity to the metal pad from an area adjacent the second face of the substrate; and an electrically insulating first passivation layer disposed between the metal layer and the substrate arranged to provide electrical insulation between the substrate and the metal layer.

Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.

Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.

Abstract: An apparatus for micro-electro-mechanical (MEMS) reinforcement is described herein. The apparatus includes a MEMS device and a stiffener. A micro scale mirror is to be embedded in a top layer of a substrate of the MEMS device. The stiffener is to be coupled to a back side of the MEMS device, wherein the stiffener is to stiffen the MEMS device via support of the MEMS device, without increasing a thickness of the MEMS device.

Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.

Abstract: Optical apparatus includes a semiconductor substrate and one or more radiation sources, mounted on a surface of the substrate and configured to emit optical radiation. A scanning mirror is mounted on the substrate and is configured to scan the reflected optical radiation over a predetermined angular range in a direction that is angled away from the surface.

Abstract: An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an MEMS device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the MEMS device.