Patents by Inventor Issa S. Mahmoud

Issa S. Mahmoud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5615827
    Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: April 1, 1997
    Assignee: International Business Machines Corporation
    Inventors: Roy L. Arldt, Susan H. Downey, Harry J. Golden, Issa S. Mahmoud, Clement A. Okoro, James Spalik
  • Patent number: 5571593
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: November 5, 1996
    Assignee: International Business Machines Corporation
    Inventors: Roy L. Arldt, Christina M. Boyko, Burtran J. Cayson, Richard M. Kozlowski, Joseph D. Kulesza, John M. Lauffer, Philip C. Liu, Voya R. Markovich, Issa S. Mahmoud, James F. Muska, Kostas Papathomas, Joseph G. Sabia, Richard A. Schumacher
  • Patent number: 5531838
    Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: July 2, 1996
    Assignee: International Business Machines Corporation
    Inventors: Roy L. Arldt, Susan H. Downey, Harry J. Goldlen, Issa S. Mahmoud, Clement A. Okoro, James Spalik
  • Patent number: 5286417
    Abstract: A fusible conductive adhesive for making electrical and mechanical contact is provided. The fusible conductive adhesive contains a polymer having a glass transition temperature and a thermal expansion co-efficient. The thermal expansion co-efficient of the polymer is in the range of about 5 parts per million per degree centigrade to about 10 parts per million per degree centigrade along a z-axis. The polymer is loaded with a conductive material having a sintering temperature range overlapping the glass transition temperature of the polymer. In addition, the loading of the conductive material in the polymer is in the range of about 15% to about 20% conductive material by weight based on the total weight of the polymer and the conductive material.
    Type: Grant
    Filed: December 6, 1991
    Date of Patent: February 15, 1994
    Assignee: International Business Machines Corporation
    Inventors: Issa S. Mahmoud, Julian P. Partridge
  • Patent number: 5214250
    Abstract: Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor.
    Type: Grant
    Filed: September 19, 1991
    Date of Patent: May 25, 1993
    Assignee: International Business Machines Corporation
    Inventors: Burtran J. Cayson, John A. Covert, Steven A. Duncan, John M. Lauffer, Issa S. Mahmoud, Richard A. Schumacher
  • Patent number: 5197655
    Abstract: Methods and apparatus are provided for applying solder in precise amounts to fine pitch leads such as those suitable for direct chip attachment (DCA) or flip-chip applications by using a heated platen to apply pressure to solder overlaying a plurality of lands on circuitized substrate. In one embodiment paste solder screened through a mask having apertures each corresponding to a plurality of land locations. In another embodiment, a web of solder foil is accurately positioned over a plurality of fine pitch lands. In each embodiment, a heated platen includes at least one active element corresponding in size and shape to the area having a plurality of fine pitch lands. A third embodiment includes individual platens for lands to which solder is to be applied.
    Type: Grant
    Filed: June 5, 1992
    Date of Patent: March 30, 1993
    Assignee: International Business Machines Corporation
    Inventors: Arthur L. Leerssen, Everitt W. Mace, Issa S. Mahmoud, Charles T. Randolph, John Reece, Gaston G. Settle, Phong T. Truong, Srini V. Vasan
  • Patent number: 4990224
    Abstract: An acid copper plating bath and process for using with electropositive metals such as aluminum and tungsten is described, wherein the bath contains sulfuric acid, copper sulfate, in solution with urea as a levelling agent, a cationic surfactant as a wetting agent and an ester of a sulfonic acid, Beta-phenylethyltosylate as a brightening agent.
    Type: Grant
    Filed: October 25, 1989
    Date of Patent: February 5, 1991
    Assignee: International Business Machines Corporation
    Inventor: Issa S. Mahmoud
  • Patent number: 4956022
    Abstract: A chemical polishing bath and process are disclosed for pretreating aluminum and its alloys prior to plating or anodizing operations, which bath and process produce a mirrorlike finish.
    Type: Grant
    Filed: July 12, 1989
    Date of Patent: September 11, 1990
    Assignee: International Business Machines Corporation
    Inventor: Issa S. Mahmoud
  • Patent number: 4954226
    Abstract: An additive plating bath and process are described for use in printed circuit manufacturing for applying copper to thick film patterns, said bath includes a low concentration of sulfuric acid, copper sulfate, urea, glycerin and a surface active agent in an aqueous solution.
    Type: Grant
    Filed: October 25, 1989
    Date of Patent: September 4, 1990
    Assignee: International Business Machines Corporation
    Inventor: Issa S. Mahmoud
  • Patent number: 4954370
    Abstract: A novel electroless plating bath composition and method for the use thereof, are described for depositing a layer of nickel on anodized aluminum substrates for facilitating direct attachment of electronic chips thereto; the bath composition being a neutralized solution of nickel sulfate, sodium citrate, lactic acid and dimethylbomine in deionized water.
    Type: Grant
    Filed: December 21, 1988
    Date of Patent: September 4, 1990
    Assignee: International Business Machines Corporation
    Inventor: Issa S. Mahmoud
  • Patent number: 4898651
    Abstract: A process for preparing aluminum alloy substrates for use in electrical packaging includes anodizing in an aqueous bath solution containing sulfuric acid, citric acid, urea, and ammoniated colloidal silica; the latter three components being a complexing agent, a leveling agent and a stabilizing agent, respectively, so as to result in an oxide layer having an amorphous structure which eliminates the necessity of sealing thick anodic coating.
    Type: Grant
    Filed: August 25, 1989
    Date of Patent: February 6, 1990
    Assignee: International Business Machines Corporation
    Inventor: Issa S. Mahmoud
  • Patent number: 4894126
    Abstract: An anodizing bath for aluminum alloys is disclosed; the aqueous bath solution contains sulfuric acid, citric acid, urea, and ammoniated colloidal silica; the latter three components being a complexing agent, a leveling agent and a stabilizing agent, respectively, so as to result in an oxide layer having and amorphous structure which eliminates the necessity of sealing thick anodic coating.
    Type: Grant
    Filed: January 15, 1988
    Date of Patent: January 16, 1990
    Inventor: Issa S. Mahmoud
  • Patent number: 4750262
    Abstract: A composite substrate suitable for use as substrates for printed circuitry to which surface mountable components may be attached is disclosed. The substrate material comprises an alloy having a low coefficient of thermal expansion, to which aluminum is laminated and which is subsequently surface treated to produce a dielectric layer suitable to receive printed circuitry.
    Type: Grant
    Filed: May 1, 1986
    Date of Patent: June 14, 1988
    Assignee: International Business Machines Corp.
    Inventors: Issa S. Mahmoud, Gustav Schrottke
  • Patent number: 4636251
    Abstract: A new alloy material for use in electrical contacts is disclosed, comprising by weight______________________________________ Beryllium 1-2% Palladium 2-20%; and ______________________________________the balance of nickel.
    Type: Grant
    Filed: April 17, 1986
    Date of Patent: January 13, 1987
    Assignee: International Business Machines Corporation
    Inventor: Issa S. Mahmoud
  • Patent number: 4431707
    Abstract: Nickel and copper are plated over a thick anodic coating on an aluminum substrate as a step in the manufacture of printed circuit board substrates.
    Type: Grant
    Filed: December 27, 1982
    Date of Patent: February 14, 1984
    Assignee: International Business Machines Corporation
    Inventors: Richard W. Burns, Issa S. Mahmoud