Patents by Inventor Issei AOKI

Issei AOKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION FOR FILM, FILM, FILM WITH BASE MATERIAL, METAL/RESIN LAMINATE BODY, RESIN CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING FILM
    Publication number: 20190160785
    Abstract: Provided is a resin composition for a film, which is used for producing the film having excellent insulating properties and thermal conductivity. The provided resin composition for the film contains a thermosetting resin (A) and hexagonal boron nitride secondary agglomerated particles (B). Here, the hexagonal boron nitride secondary agglomerated particles (B) contains hexagonal boron nitride secondary agglomerated particles (B-1) having a cohesive breaking strength of 7 MPa or more and hexagonal boron nitride secondary agglomerated particles (B-2) having a cohesive breaking strength of 3 MPa or more and less than 7 MPa.
    Type: Application
    Filed: June 26, 2017
    Publication date: May 30, 2019
    Applicant: NAMICS CORPORATION
    Inventors: Fumikazu KOMATSU, Issei AOKI, Junya SATO, Hiroshi TAKASUGI, Shin TERAKI