Abstract: The present invention provides an organic light-emitting device which can prevent a covering member from being damaged or peeled off, and which can be manufactured with excellent productivity and cost performance; and a method for manufacturing the organic light-emitting device. The covering member has a chamfer formed on the side of a face of the covering member on a reverse side to the side of an organic light-emitting element.

Abstract: The present invention provides an organic light-emitting device which can prevent a covering member from being damaged or peeled off, and which can be manufactured with excellent productivity and cost performance; and a method for manufacturing the organic light-emitting device. The covering member has a chamfer formed on the side of a face of the covering member on a reverse side to the side of an organic light-emitting element.

Abstract: The present invention provides an organic light-emitting device which can prevent a covering member from being damaged or peeled off, and which can be manufactured with excellent productivity and cost performance; and a method for manufacturing the organic light-emitting device. The covering member has a chamfer formed on the side of a face of the covering member on a reverse side to the side of an organic light-emitting element.

Abstract: A semiconductor device with a configuration having a high sealing capability using a ultraviolet curing resin is provided, wherein a cover and a substrate contact each other, and the ultraviolet cured resin is disposed on the contacting end of both and cured.

Abstract: An organic luminescence device including organic layers disposed between an anode and a cathode is produced through a process including: a step of forming a first organic layer over an anode already formed on a first substrate; a step of forming a second organic layer comprising an identical material forming the first organic layer over a cathode already formed on a second substrate; and a combining step of disposing the first and second organic layers opposite to each other and applying the first and second organic layer to each other under pressure, followed by baking, to form a laminate organic luminescence device. A step of pre-baking at least one of the first and second organic layers is preferably included prior to the combining step. As a result, the organic layers in the luminescence device can be formed free from binders and yet in a good adhesion therebetween.

Abstract: A process for producing a liquid crystal device, including the steps of: providing a pair of electrode plates; disposing a sealing agent on at least one of the electrode plates so as to define a region to be filled with a liquid crystal; dispersing adhesive beads over at least one of the electrode plates; adhesively bonding the electrode plates to each other by curing the sealing agent and the adhesive beads under heating and pressure of the electrode plates. In the adhesively bonding step, the pair of electrode plates are provided with at least one heating member capable of setting a prescribed heating temperature for every prescribed region so as to cure the sealing agent and the adhesive beads. The above heating member is effective in improving an adhesive strength of the adhesive beads resulting in a good shock resistance of the resultant liquid crystal device and shortening a curing treatment time of the sealing agent.