Abstract: A solder removing bit for use in melting solder by heat of the bit and for removing the solder by suction includes an elongated bit body having an inclined front surface. A suction bore extends the length of the body from a suction pipe opening at the rear end thereof and is exposed at the center of the inclined surface by a right-angled notch. A portion of the bore is left on one surface of the notch to form a slight groove which prevents blockage of the bore during use. A cross notch is provided across said surface of the right-angled notch to intersect the groove.

Abstract: A solder removing bit for use in melting solder by heat of the bit and for removing the solder by suction includes an elongated suction pipe having a suction bore extending therethrough with the pipe having an open end serving as an inlet to the bore. A tubular metallic bit surrounds the open end portion of the pipe and a tubular electric heater surrounds the bit. The end of the heater is spaced from the end of the bit to define a work contacting end portion on the bit. The end portion of the bit is provided with a coating of fused silica or porcelain enamel to render the end portion of the bit electrically insulative.