Abstract: A method for failed die clustering is provided that includes extracting a data set of failed die on a wafer from a wafer map for the wafer, determining a density parameter for clustering the failed die, removing false failures from the data set of failed die to generate a reduced data set of failed die, locating clusters of failed die in the reduced data set by executing a density-based spatial clustering of applications with noise (DBSCAN) algorithm with the density parameter, and applying a guard band to each located cluster.

Abstract: A method of probing wafers includes providing a processor running a parametric test program generator algorithm which execute steps including reading a stored first probe program including a first test sequence (TS1) having a first tests configured for probing at least a first circuit element (FCE) in a first scribe line module. TS1 includes (i) electrical pinning and geometrical data and (ii) first Variable Group data specific for the FCE including first test parameters having at least first forcing conditions. The (ii) is modified with modified second variable group data specific to a second circuit element (SCE) in a second scribe line module. The modified second Variable Group data includes modified second test parameters having second forcing conditions. (i) of TS1 is merged with the modified second Variable Group data to generate code for a second test sequence of a second probe program that is configured for probing the SCE.

Abstract: A method of probing wafers includes providing a processor running a parametric test program generator algorithm which execute steps including reading a stored first probe program including a first test sequence (TS1) having a first tests configured for probing at least a first circuit element (FCE) in a first scribe line module. TS1 includes (i) electrical pinning and geometrical data and (ii) first Variable Group data specific for the FCE including first test parameters having at least first forcing conditions. The (ii) is modified with modified second variable group data specific to a second circuit element (SCE) in a second scribe line module. The modified second Variable Group data includes modified second test parameters having second forcing conditions. (i) of TS1 is merged with the modified second Variable Group data to generate code for a second test sequence of a second probe program that is configured for probing the SCE.