Abstract: Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cycloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Abstract: Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cyloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.

Abstract: This invention is directed to thermoplastic polyamides and the preparation thereof. The thermoplastic polyamides, which are prepared by condensing (a) dimerized higher fatty acids and (b) monomeric fatty acids with (c) polyether diamines and (d) aliphatic or cycloaliphatic diamines, are useful in melt adhesive compositions.

Abstract: This invention relates to adhesive composition. More particularly, this invention relates to adhesive compositions comprising polyamide (I) prepared by condensing dimeric higher fatty acids and monomeric fatty acids with polyether diamines and aliphatic or cycloaliphatic diamines and polyamide (II) prepared by condensing dimeric higher fatty acids and monomeric fatty acids with aliphatic or cycloaliphatic polyamines.

Abstract: A hot melt adhesive is disclosed, to be used in gluing guns, and consisting of a polyamide resin obtained by polycondensation of an aliphatic diamine with a fatty acid mixture, said fatty acid mixture consisting of unsaturated fatty acid monomers and polymers with a maximum dimer content of 80% by weight to which are added, in a quantity of not less than 10% by weight of the fatty acid mixture, aliphatic bicarboxylic acids and/or their esters with a polyethylene chain containing 6 to 10 carbon atoms. As an alternative a quantity of not less than 4% by weight of the fatty acid mixture, aromatic bicarboxylic acids and/or their esters, or mixtures of these latter with aliphatic bicarboxylic acids, can be added to the mixture.