Patents by Inventor Itamar Lavy

Itamar Lavy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS WITH CIRCUIT-LOCATING MECHANISM
    Publication number: 20250201331
    Abstract: An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
    Type: Application
    Filed: March 6, 2025
    Publication date: June 19, 2025
    Inventors: Itamar Lavy, Chunhao Wang, Wesley B. Butler
  • Apparatus with circuit-locating mechanism
    Patent number: 12266411
    Abstract: An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
    Type: Grant
    Filed: February 22, 2024
    Date of Patent: April 1, 2025
    Assignee: Micron Technology, Inc.
    Inventors: Itamar Lavy, Chunhao Wang, Wesley B. Butler
  • APPARATUS WITH CIRCUIT-LOCATING MECHANISM
    Publication number: 20240265990
    Abstract: An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
    Type: Application
    Filed: February 22, 2024
    Publication date: August 8, 2024
    Inventors: Itamar Lavy, Chunhao Wang, Wesley B. Butler
  • Apparatus with circuit-locating mechanism
    Patent number: 11967390
    Abstract: An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: April 23, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Itamar Lavy, Chunhao Wang, Wesley B. Butler
  • APPARATUS WITH CIRCUIT-LOCATING MECHANISM
    Publication number: 20230087823
    Abstract: An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 23, 2023
    Inventors: Itamar Lavy, Chunhao Wang, Wesley B. Butler
  • Apparatus with circuit-locating mechanism
    Patent number: 11551777
    Abstract: An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: January 10, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Itamar Lavy, Chunhao Wang, Wesley B. Butler
  • APPARATUS WITH CIRCUIT-LOCATING MECHANISM
    Publication number: 20210043267
    Abstract: An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
    Type: Application
    Filed: August 9, 2019
    Publication date: February 11, 2021
    Inventors: Itamar Lavy, Chunhao Wang, Wesley B. Butler