Abstract: A virtual travel service system accepts a boarding request for a virtual passenger airplane, which is an example of a virtual vehicle, from a user's communication terminal before the departure time of the virtual passenger airplane and registers the user as a passenger of the virtual passenger airplane. A common boarding experience is provided to a plurality of passengers on the virtual passenger airplane.

Abstract: An ultrasonic sensor includes: an ultrasonic element provided to transmit or receive an ultrasonic wave propagating along a directional axis; and an element housing case that includes a case diaphragm having a thickness direction along the directional axis. A resonant space is defined between the case diaphragm and the ultrasonic element for the propagating wave, by housing the ultrasonic element while separating the ultrasonic element from the case diaphragm. A horn shape is defined in the element housing case in which a width of the resonant space in a direction orthogonal to the directional axis is reduced as the resonant space extends in an axial direction parallel to the directional axis.

Abstract: An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.

Abstract: An ultrasonic sensor includes an ultrasonic element and an element accommodation case. A side wall portion of the element accommodation case has a tubular shape surrounding a directional central axis. A bottom wall portion and a top wall portion of the element accommodation case cover ends of the side wall portion in a direction along the directional central axis. The top wall portion has a diaphragm portion. The bottom wall portion supports the ultrasonic element. For example, the ultrasonic element is opposed to the diaphragm portion across a gap defining an interval corresponding to an integral multiple of half of a wavelength of ultrasonic vibration. Alternatively, the diaphragm portion is formed of a material having an acoustic impedance of 50×105 Pa·s/m or more and 5000×105 Pa·s/m or less, and has a thickness of 1 mm or less.

Abstract: An ultrasonic sensor includes: an ultrasonic element provided to transmit or receive an ultrasonic wave propagating along a directional axis; and an element housing case that includes a case diaphragm having a thickness direction along the directional axis. A resonant space is defined between the case diaphragm and the ultrasonic element for the propagating wave, by housing the ultrasonic element while separating the ultrasonic element from the case diaphragm. A horn shape is defined in the element housing case in which a width of the resonant space in a direction orthogonal to the directional axis is reduced as the resonant space extends in an axial direction parallel to the directional axis.

Abstract: An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d?h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: There is provided a fluidic device that is small, that can reduce contamination inclusion, and that can improve efficiency. A fluidic device includes a first constituent member internally having a first channel, and a mounting substrate internally having a second channel, the first constituent member being mounted on the mounting substrate. The mounting substrate has a storage portion for storing a fluid which is supplied to the first channel and a collecting portion for storing a fluid which is discharged from the first channel. The second channel has a supplying channel portion connected to the storage portion and a collecting channel portion connected to the collecting portion. The supplying channel portion and the collecting channel portion are connected to each other via the first channel.

Abstract: A bonding structure of a vibration isolation target is disclosed. The structure includes: a base; a vibration isolation target mounted to the base; and a vibration isolator bonds together the base and the vibration isolation target. A lift-up portion is formed on one of the base and the vibration isolation target, and is lift-upped from the one toward the other of the base and the vibration isolation target. The lift-up portion has an apex surface located at an apex of the lift-up portion. The vibration isolator is on the apex surface.

Abstract: A microelectromechanical apparatus (X) includes a microelectromechanical component (10), an insulating substrate (21), a through via (22c) disposed in the insulating substrate (21), a sealing member (30) and a conductive connecting member (40). The microelectromechanical device (10) has a semiconductor substrate (11), a microelectromechanical system (12) and an electrode (13) electrically connected to the microelectromechanical system (12). The sealing member (30) is made of glass, is disposed so as to enclose the microelectromechanical system (12) between the semiconductor substrate (11) and the insulating substrate (21), and hermetically seals the microelectromechanical system (12). The conductive connecting member (40) electrically connects the electrode (13) and an end of the through via (22c), at a position spaced away from the sealing member (30).

Abstract: A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d?h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A microelectromechanical apparatus (X) includes a microelectromechanical component (10), an insulating substrate (21), a through via (22c) disposed in the insulating substrate (21), a sealing member (30) and a conductive connecting member (40). The microelectromechanical device (10) has a semiconductor substrate (11), a microelectromechanical system (12) and an electrode (13) electrically connected to the microelectromechanical system (12). The sealing member (30) is made of glass, is disposed so as to enclose the microelectromechanical system (12) between the semiconductor substrate (11) and the insulating substrate (21), and hermetically seals the microelectromechanical system (12). The conductive connecting member (40) electrically connects the electrode (13) and an end of the through via (22c), at a position spaced away from the sealing member (30).

Abstract: The invention relates to a microstructure apparatus. A microstructure apparatus according to one of the invention includes a first substrate having a surface on which a microstructure is disposed; a second substrate having a surface opposing the microstructure; and a sealing member that bonds the opposing surfaces of the first substrate and the second substrate and that encloses and seals the microstructure. The sealing member includes a brazing metal containing a filler.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.