Abstract: A semiconductor device according to an aspect of the invention includes plural line pattern and plural pad patterns. The line patterns are repeatedly disposed with a space pattern interposed therebetween. The pad pattern straddles plural columns of the line patterns. The pad pattern is connected to the line pattern located on one side of the pad pattern in one of the plural columns, the pad pattern is connected to the line pattern located on the other side of the pad pattern in another column of the plural columns, and the line pattern located on one side of the pad pattern includes an open-circuit portion in another column. Therefore, a semiconductor device in which an interconnection pattern including the fine line-and-space-shape line pattern and the pad pattern is accurately formed at low cost, a semiconductor device production method, and a photomask used to produce the semiconductor device can be provided.

Abstract: A forming method of a fine resist pattern improve so as to form a fine pattern of high accuracy can be obtained. A positive-type photoresist 1 including naphthoquinone diazide and novolak resin is applied on a substrate. An anti-reflection film adjusted to alkalinity is applied on positive-type photoresist 1. Positive-type photoresist 1 on which anti-reflection film 9 is applied is selectively irradiated. Positive-type photoresist 1 is developed.