Abstract: A method of manufacturing a magnetic recording medium having at least a magnetic layer, optionally by means of an underlayer, on a non-magnetic substrate, and occasionally having a protective layer disposed on the magnetic layer, comprises irradiating to the surface of the non-magnetic substrate, the underlayer, the magnetic layer, the protective layer or the magnetic recording medium, a laser beam from a semiconductor laser module that moves relatively to the non-magnetic substrate, thereby applying a texturing; and a semiconductor laser texturing apparatus comprises a substrate rotating mechanism, a semiconductor laser module including a semiconductor laser beam source, a collimator for converting a semiconductor laser beam into a parallel beam and a light focusing mechanism for irradiating the laser beam to a projection-forming surface of a substrate supported rotatably by the substrate rotating mechanism, and a relative moving mechanism for the substrate supported rotatably by the substrate rotating mecha

Abstract: Disclosed herein is a semiconductor laser element comprising a first cladding layer, an optical guiding layer, an active layer and a second cladding layer disposed in this order or in reverse order on a semiconductor substrate, a refractive index of the optical guiding layer being larger than both refractive indexes of the first and second cladding layers, and a refractive index of the optical guiding layer is smaller than that of the active layer but larger than that of the first cladding layer, and a burying layer having a refractive index smaller than that of at least one of the first and second cladding layers being disposed on side faces other than laser-emitting faces of the optical guiding layer and the active layer.

Abstract: A multi-conductor cable such as an electrical power cable, a signal-transmission cable or optical fiber cable, including a core made of a plurality of insulated conductors, a sheath surrounding the core, and a plurality of foamed plastic string fillers which fill the void space between the core and the sheath and between the insulated conductors.