Abstract: Systems and methods for improving high frequency transmission in printed circuit boards use the smooth internal interfaces between the conducting laminate and dielectric substrates of PCB cores to serve as signal carrying lines and ground planes in transmission lines. Flanking PCB cores may be mounted to a central dielectric layer including a stripped PCB core providing structural integrity of the PCB.

Abstract: An antenna structure includes a dielectric material in which antenna array elements are placed on either side. Elements on either side of the dielectric material overlap or are staggered opposing elements. The dielectric material may also include co-located, antenna arrays of array elements radiating in different directions. Antenna array elements may be formed using conformal shielding which applied and selectively removed to create antenna structures. Devices that include the antenna structure can include a casing that is a shaped lens to increase antenna aperture size and enhance antenna performance.

Abstract: An antenna structure includes a dielectric material in which antenna array elements are placed on either side. Elements on either side of the dielectric material overlap or are staggered opposing elements. The dielectric material may also include co-located, antenna arrays of array elements radiating in different directions. Antenna array elements may he formed using conformal shielding which applied and selectively removed to create antenna structures. Devices that include the antenna structure can include a casing that is a shaped lens to increase antenna aperture size and enhance antenna performance.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages and devices, wherein a microelectronic package may be formed with an interposer with at least one microelectronic component attached to an active surface of the interposer, and at least one coaxial connector attached to an opposing attachment surface of the interposer. The microelectronic package may be attached to a substrate to form the microelectronic device, wherein the substrate includes an opening therethrough for access to the at least one coaxial connector.