Abstract: An assembled body of an electronic endoscope which is capable of reducing the diameter of the endoscope and simplifying the structure thereof. The assembled body comprises an imaging device provided with a color filter and a microlens on the imaging plane, and an objective optical member connected to the imaging device. A circuit board with a wiring pattern and a through hole formed thereon and therein is inserted and adhered between the imaging plane of the imaging device and a prism as a part of the objective optical member. The terminals on the imaging device are connected to the terminals on the circuit board by contact bonding. Since the through hole in the circuit board forms an air gap on the imaging plane, it is possible to protect the color filter and the microlens.

Abstract: An assembled body of an electronic endoscope which is capable of reducing the diameter of the endoscope and simplifying the structure thereof. The assembled body comprises an imaging device with a color filter and a microlens provided on the imaging plane, and an objective optical member for catching an object of inspection. An opening is formed in a cover glass as the objective optical member, and the cover glass is directly adhered to the imaging plane of the imaging device. An air gap is set by the opening of the cover glass. The cover glass and the imaging device are adhered to each other with an adhesive so as to keep the air gap in an airtight state. It is thus possible to directly combine the imaging device with the optical member without using a package. A groove may be formed as the air gap in a prism as a part of the objective optical member.

Abstract: A circuit board of a solid-state image sensor (CCD) in an electronic endoscope apparatus for inspecting internal cavities of the body by inserting an electronic endoscope having the CCD at one end thereof into an object of inspection and displaying the image of the object on a monitor. The circuit board has a package to which the CCD is attached. A groove portion is provided at one end of the package and connecting terminals are disposed on the upper surface and the under surface of the groove portion. A substrate with a wiring pattern formed both sides thereon is fitted into the groove portion and the circuits are connected. In an endoscope in which the image picked up by the CCD is reversed side by side, the substrate is connected upside down to the package. Thus, this circuit board facilitates correspondence to various structures of endoscopes. Reduction of the diameter of the endoscope is also possible.