Abstract: An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.

Abstract: An adhesive sheet comprising a hot-melt adhesive layer. The hot-melt type adhesive layer comprises a modified polymer (A) to which a cross-linkable group is bonded and a polyolefin (B). The adhesive sheet can adhere to various adherends and the adhesive becomes less likely to squeeze out from an adherend in thermal fusion bonding and sealing of the adherend. In a laminate comprising the adhesive sheet the adhesive layer does not squeeze out from the adherend without being affected by the material of the adherend.

Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of ?1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of ?1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

Abstract: To provide a hot-melt pressure-sensitive adhesive which is easily coated, has a weak odor, high stability with time, and is also excellent in adhesive force retention performance from a low temperature range to a high temperature range. A hot-melt pressure-sensitive adhesive comprising: an amorphous polystyrene resin (A) having a number-average molecular weight of 50,000 or more; and a thermoplastic block copolymer (B) which is a copolymer of vinyl-based aromatic hydrocarbons and conjugated diene compounds.

Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.

Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.

Abstract: To provide a hot-melt pressure-sensitive adhesive which is easily coated, has a weak odor, high stability with time, and is also excellent in adhesive force retention performance from a low temperature range to a high temperature range. A hot-melt pressure-sensitive adhesive comprising: an amorphous polystyrene resin (A) having a number-average molecular weight of 50,000 or more; and a thermoplastic block copolymer (B) which is a copolymer of vinyl-based aromatic hydrocarbons and conjugated diene compounds.

Abstract: There are provided a hot-melt adhesive, which is excellent in solvent resistance and is excellent in adhesion to an adherend (specifically, a polyimide film) containing an electrolytic solution of a battery therein, and also can contribute to an improvement in performances of electric instruments; and an electric instrument produced by using such hot-melt adhesive. A hot-melt adhesive for electric instruments, comprising an olefin based modified polymer (A), the olefin based modified polymer (A) being a modified polymer having a functional group containing silicon, is excellent in resistance to an electrolytic solution of a battery (that is, electrolytic solution resistance or solvent resistance), and also exhibits improved adhesion of the hot-melt adhesive to an adherend (plastic film such as a polyimide film) containing the electrolytic solution therein.

Abstract: There are provided a hot-melt adhesive, which is excellent in solvent resistance and is excellent in adhesion to an adherend (specifically, a polyimide film) containing an electrolytic solution of a battery therein, and also can contribute to an improvement in performances of electric instruments; and an electric instrument produced by using such hot-melt adhesive. A hot-melt adhesive for electric instruments, comprising an olefin based modified polymer (A), the olefin based modified polymer (A) being a modified polymer having a functional group containing silicon, is excellent in resistance to an electrolytic solution of a battery (that is, electrolytic solution resistance or solvent resistance), and also exhibits improved adhesion of the hot-melt adhesive to an adherend (plastic film such as a polyimide film) containing the electrolytic solution therein.

Abstract: An adhesive sheet comprising a hot-melt adhesive layer. The hot-melt type adhesive layer comprises a modified polymer (A) to which a cross-linkable group is bonded and a polyolefin (B). The adhesive sheet can adhere to various adherends and the adhesive becomes less likely to squeeze out from an adherend in thermal fusion bonding and sealing of the adherend. In a laminate comprising the adhesive sheet the adhesive layer does not squeeze out from the adherend without being affected by the material of the adherend.

Abstract: The invention relates to a photo-embossing process for the preparation of a polymeric relief structure comprising the steps of: a) coating a substrate with a coating composition comprising one or more radiation-sensitive ingredients and less than 30 wt % polymeric binder material; b) locally treating the coated substrate with electromagnetic radiation having a periodic, non-periodic or random radiation-intensity pattern, forming a latent image, at a temperature below a transition temperature of the coating composition; and c) polymerizing and/or crosslinking the resulting coated substrate, at a temperature above said transition temperature, wherein the transition temperature is a temperature that defines a transition of the coating composition between a state of high viscosity and low viscosity and wherein the coating composition comprises a compound A comprising at least one radiation curable group and a photoinitiator, the coating composition having a transition temperature between 30° C. and 120° C.

Abstract: The invention relates to a photo-embossing process for the preparation of a polymeric relief structure comprising the steps of: a) coating a substrate with a coating composition comprising one or more radiation-sensitive ingredients and less than 30 wt % polymeric binder material; b) locally treating the coated substrate with electromagnetic radiation having a periodic, non-periodic or random radiation-intensity pattern, forming a latent image, at a temperature below a transition temperature of the coating composition; and c) polymerizing and/or crosslinking the resulting coated substrate, at a temperature above said transition temperature, wherein the transition temperature is a temperature that defines a transition of the coating composition between a state of high viscosity and low viscosity and wherein the coating composition comprises a compound A comprising at least one radiation curable group and a photoinitiator, the coating composition having a transition temperature between 30° C. and 120° C.