Abstract: An electrostatic chuck, that includes (a) an electrostatic chuck body having a top surface and being configured to support a sample; (b) a space formed within the electrostatic chuck body, the space has a top opening; (c) a sharp conductive element; (d) a masking electrode; and (e) a movement unit that is configured to position the masking electrode in a masking position in which the masking electrode reduce an electric field formed by the sharp conductive element when the sharp conductive element is being biased and the top opening is not covered by a backside of the sample.

Abstract: An electrostatic chuck, that includes (a) an electrostatic chuck body having a top surface and being configured to support a sample; (b) a space formed within the electrostatic chuck body, the space has a top opening; (c) a sharp conductive element; (d) a masking electrode; and (e) a movement unit that is configured to position the masking electrode in a masking position in which the masking electrode reduce an electric field formed by the sharp conductive element when the sharp conductive element is being biased and the top opening is not covered by a backside of the sample.

Abstract: A method, a non-transitory computer readable medium and a detection system for detecting an electric arc hazard related to a wafer. The detection system may include a measurement unit, an electrode and a processing unit. The measurement unit may be configured to provide a measurement result by measuring an electrical parameter of the electrode during a test period, while the wafer may be moved in relation to the electrode, and while a certain electrical field may be formed between the electrode and the wafer; wherein the certain electrical field induces detached ends of partially detached conductive elements of the wafer to move away from the wafer. The processing unit may be configured to determine an existence of the electric arc hazard based on the measurement result.

Abstract: A method, a non-transitory computer readable medium and a detection system for detecting an electric arc hazard related to a wafer. The detection system may include a measurement unit, an electrode and a processing unit. The measurement unit may be configured to provide a measurement result by measuring an electrical parameter of the electrode during a test period, while the wafer may be moved in relation to the electrode, and while a certain electrical field may be formed between the electrode and the wafer; wherein the certain electrical field induces detached ends of partially detached conductive elements of the wafer to move away from the wafer. The processing unit may be configured to determine an existence of the electric arc hazard based on the measurement result.