Patents by Inventor Itzik Nisany

Itzik Nisany has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer inspection system and a method for translating wafers
    Patent number: 8573077
    Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: November 5, 2013
    Assignee: Camtek Ltd.
    Inventors: Itzik Nisany, Amir Gilead, Michael Vainer, Valery Nuzni
  • Wafer inspection system and a method for translating wafers [PD]
    Patent number: 8281674
    Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: October 9, 2012
    Assignee: Camtek Ltd.
    Inventors: Itzik Nisany, Amir Gilead, Michael Vainer, Valery Nuzni
  • WAFER INSPECTION SYSTEM AND A METHOD FOR TRANSLATING WAFERS [PD]
    Publication number: 20090183583
    Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
    Type: Application
    Filed: August 24, 2006
    Publication date: July 23, 2009
    Inventors: Itzik Nisany, Amir Gilead, Michael Vainer, Valery Nuzni