Abstract: An implantable contact lens having a central hole with angled walls optimized to minimize light scattering is described. The central hole provides fluid flow from the posterior to the anterior chamber of the eye, and its shape and size of designed to reduce glare and halos resulting from light scattered by the walls of the hole. The design parameters of the hole are dependent on the refractive index of the material in which the central hole is formed.

Abstract: A new type of multi-focal lens that has a free-form progressive multifocal front surface consisting of a 16th order polynomial superimposed on a standard conic base surface is described. The center region of the lens is optimized for distance vision, while simultaneously optimizing the rest of the lens for near vision. The resulting free-form even asphere polynomial surface is smooth, unlike present day diffractive multifocal designs. Additionally, this lens design is suitable for both refractive and cataract surgeries.

Abstract: An optimized aspheric lens has improved optics when implanted into a patient having a curved retina. Light entering the optimized aspheric lens on-axis or at an angle to the optical axis is properly focused by the lens, reducing aberrations and producing a much smaller spot size of light on the retina. A method of selecting the optimized values for variables of the lens design, such as base radii of the front and back surface of the lens, conic constants of the front and back surfaces, and/or center thickness of the lens, among other possible parameters is provided. The method includes calculating changes in a merit function while changing the various values for the variables and selecting an optimized merit function.

Abstract: One embodiment of the present invention provides a module including a primary substrate defining a base of the module, wherein the primary substrate is provided with a plurality of vias for electrical connection to a photodetector located within an interior portion of the module; a side wall member joined to the primary substrate to form side walls of the module and to define the interior portion of the module; a secondary substrate positioned within the interior portion of the module, the photodetector being mounted on the secondary substrate; an optical fiber guide extending into the interior portion of the module from outside the module, the optical fiber being arranged to receive an optical fiber and to position the optical fiber so that light emerging from the optical fiber impinges upon the photodetector; and a lid joined to the side wall member to enclose the interior portion of the module.

Abstract: A method and system for photodetector packaging system is provided with a insulating substrate having a shoulder section and a wire bond is used for coupling the photodetector to the insulating substrate at the shoulder section. The system includes an optical fiber that directs incident light directly to the photodetector. Also provided is a method and system for packaging photodetectors with a insulating substrate using conducting vias and a wire bond to couple the photodetector to the insulating substrate. The system includes conducting tabs that are coupled to the conducting vias. The metal tabs are coupled with a transimpedance amplifier by wire bonds and the transimpedance amplifier is coupled to a limiting amplifier by wire bonds.

Abstract: A system and apparatus for packaging a laser diode is provided according to the present invention. It includes a solid structure having a first cavity, wherein the first cavity receives a fiber pipe with optical fiber, which is aligned to the laser diode. The solid structure also includes a recess that receives the fiber pipe; and a step for receiving a sealing ring. The solid structure is multi-layered and may be manufactured from ceramic material, beryllium oxide or aluminum nitride. The solid structure includes a second cavity that accommodates a fiber alignment mechanism; a sub-mount on which the laser diode is placed; and/or heat sink used for conducting heat from the laser diode.

Abstract: A system and process is provided for packaging optical-electronic components used in fiber-optics networks. A top lid with an opening covers all the components of the optical-electronic package. A fiber boot with a groove is provided, wherein the opening in the top lid mates with the fiber boot groove. The fiber boot groove is located between plural shoulders. An optical fiber passes through an opening in the fiber boot and is firmly held within the fiber boot.

Abstract: One embodiment of the present invention provides a module including a primary substrate defining a base of the module, wherein the primary substrate is provided with a plurality of vias for electrical connection to a photodetector located within an interior portion of the module; a side wall member joined to the primary substrate to form side walls of the module and to define the interior portion of the module; a secondary substrate positioned within the interior portion of the module, the photodetector being mounted on the secondary substrate; an optical fiber guide extending into the interior portion of the module from outside the module, the optical fiber being arranged to receive an optical fiber and to position the optical fiber so that light emerging from the optical fiber impinges upon the photodetector; and a lid joined to the side wall member to enclose the interior portion of the module.