Abstract: A method for performing pattern detection and alignment on a programmable logic device is disclosed. A word aligner unit, implemented by a hard intellectual property block, is configured to detect a plurality of control characters by recognizing a proper subset of bits that are common among the plurality of control characters. It is determined whether a predetermined number of consecutive control characters has been detected in a frame of data. A boundary location associated with a detected predetermined number of consecutive control characters from the word aligner unit is identified. The frame of data is aligned in response to the boundary location associated with the detected predetermined number of consecutive control characters.

Abstract: A receiver circuit includes a transition density detector circuit that generates a transition density signal based on a comparison between a transition density of data words to a transition density threshold. The receiver circuit also includes a bit shift and pattern detector circuit that bit shifts one of the data words to generate bit shifted data in response to the transition density signal indicating that the transition density of the data words has reached the transition density threshold. The bit shift and pattern detector circuit counts a number of bits shifts performed on the bit shifted data to locate a synchronization character. The receiver circuit also includes a word alignment circuit that bit shifts the data words by the number of bits shifts to generate word aligned data.

Abstract: A method for performing pattern detection and alignment on a programmable logic device is disclosed. A word aligner unit, implemented by a hard intellectual property block, is configured to detect a plurality of control characters by recognizing a proper subset of bits that are common among the plurality of control characters. It is determined whether a predetermined number of consecutive control characters has been detected in a frame of data. A boundary location associated with a detected predetermined number of consecutive control characters from the word aligner unit is identified. The frame of data is aligned in response to the boundary location associated with the detected predetermined number of consecutive control characters.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: Stone is formed from 5 to 60% by weight of polymerised, low-viscosity, transparent or low-colour-resin, 20 to 90% by weight of spherical alumina trihidrate Al2O3.3H2O containing less regular particles containing, advantageously 0 to 100% by weight of a transparent or translucent substitute of alumina trihydrate, and/or with 0 to 20% or pre-prepared particulate, filled resin of a chosen colour, and/or mineral particles and less than 2% by weight of luminophor. These individual components are mixed intensely whilst extracting included gaseous parts. Extraction is carried out whilst mixing, and/or after mixing, and/or before mixing. The mixture is initiated by introducing a starter and intensely mixing it into the mixture. The mixture is poured into a mould or onto a moving endless belt. The cured synthetic stone is removed from the mould or the hardened composite is taken off the the belt. Synthetic stone can be used in products as a light carrier.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Abstract: An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.