Patents by Inventor Ivan Junju Huang

Ivan Junju Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180254239
    Abstract: Methods for reliable interconnect structures between thin metal capture pads and TGV metallization and resulting devices are provided. Embodiments include forming a TGV in a glass substrate; filling with metal conductive paste; forming a metal layer on top and bottom surfaces of the substrate; patterning the metal layer, leaving at least a portion over the TGV top surface and an area surrounding the TGV; forming a dielectric layer on the metal layer and on the substrate top and bottom surfaces; patterning the dielectric layer, including exposing the metal layer over the TGV top surface and the area surrounding the TGV; forming a second metal layer on the dielectric layer and on the exposed portion of the first metal layer over the TGV top surface and the area surrounding the TGV; patterning the second metal layer exposing the dielectric layer; and forming a third metal layer on the second metal layer.
    Type: Application
    Filed: March 1, 2017
    Publication date: September 6, 2018
    Inventors: Vijay SUKUMARAN, Ivan Junju HUANG, Saket CHADDA, Elavarasan T. PANNERSELVAM, Chok W. HO
  • Publication number: 20160260675
    Abstract: A method of forming slots into a substrate surrounding via interconnects at the periphery of a die to create a standoff between mismatched materials and the resulting device are provided. Embodiments include providing a substrate including one or more dies; providing via interconnects at a periphery of at least one die; and forming parallel trenches in the substrate on opposite sides of each via interconnect.
    Type: Application
    Filed: March 4, 2015
    Publication date: September 8, 2016
    Inventor: Ivan Junju HUANG
  • Patent number: 6357770
    Abstract: The wheel suspension of the invention is a thin-profile wheel suspension system including spring and dampening mechanisms and an optional brake and drive motor, mounted to a suspension frame in a compact arrangement which permits all or most of the sprung components to be mounted within the volume enclosed by the rim of a wheel, and thus the wheel suspension of the invention may be referred to as an “in-wheel suspension”. The wheel suspension comprises a hub plate assembly including hub bearings and axle. The hub plate is mounted to a suspension frame by a motion-controlling sliding mount assembly, which connects the hub plate to the suspension frame while it permits the hub plate to slidably move in response to wheel loads. In the preferred embodiment, the suspension frame includes two forks, each fork mounting a sliding rail mount assembly comprising a slide-and-rail mechanism aligned vertically on the suspension frame and mounted to the hub plate.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: March 19, 2002
    Inventors: André Carpiaux, William D. T. Davis, Ivan Junju Huang, Andreas Kaiser, Alexander S. Ko, Martin Koebler, Timothy James Loew