Patents by Inventor Ivan Kmecko
Ivan Kmecko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11858806Abstract: In described examples, a first metal layer is configured along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is adjacent the first metal layer. The second metal layer includes a cantilever. The cantilever is configured to deform by bonding the first substrate to the second substrate. The deformed cantilevered is configured to impede contaminants against contacting an element within the cavity.Type: GrantFiled: August 11, 2021Date of Patent: January 2, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: John Charles Ehmke, Ivan Kmecko
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Publication number: 20210371272Abstract: In described examples, a first metal layer is configured along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is adjacent the first metal layer. The second metal layer includes a cantilever. The cantilever is configured to deform by bonding the first substrate to the second substrate. The deformed cantilevered is configured to impede contaminants against contacting an element within the cavity.Type: ApplicationFiled: August 11, 2021Publication date: December 2, 2021Inventors: John Charles Ehmke, Ivan Kmecko
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Publication number: 20200391993Abstract: In described examples, a first metal layer is configured along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is adjacent the first metal layer. The second metal layer includes a cantilever. The cantilever is configured to deform by bonding the first substrate to the second substrate. The deformed cantilevered is configured to impede contaminants against contacting an element within the cavity.Type: ApplicationFiled: August 31, 2020Publication date: December 17, 2020Inventors: John Charles Ehmke, Ivan Kmecko
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Patent number: 10759658Abstract: In described examples, a first metal layer is arranged along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is arranged adjacent to the first metal layer, where the second metal layer includes a cantilever. The cantilever is arranged to deform in response to forces applied from a contacting structure of the second substrate during bonding of the first substrate to the second substrate. The deformed cantilevered is arranged to impede contaminants against contacting an element within the cavity.Type: GrantFiled: December 10, 2018Date of Patent: September 1, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: John Charles Ehmke, Ivan Kmecko
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Publication number: 20200180946Abstract: In described examples, a first metal layer is arranged along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is arranged adjacent to the first metal layer, where the second metal layer includes a cantilever. The cantilever is arranged to deform in response to forces applied from a contacting structure of the second substrate during bonding of the first substrate to the second substrate. The deformed cantilevered is arranged to impede contaminants against contacting an element within the cavity.Type: ApplicationFiled: December 10, 2018Publication date: June 11, 2020Inventors: John Charles Ehmke, Ivan Kmecko
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Patent number: 9966194Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: GrantFiled: December 20, 2016Date of Patent: May 8, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal, Arthur M. Turner, John C. Ehmke
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Publication number: 20170098509Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: ApplicationFiled: December 20, 2016Publication date: April 6, 2017Inventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal, Arthur M. Turner, John C. Ehmke
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Patent number: 9573801Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: GrantFiled: February 15, 2016Date of Patent: February 21, 2017Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal
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Publication number: 20160176701Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.Type: ApplicationFiled: February 15, 2016Publication date: June 23, 2016Inventors: Arun Gupta, William C. McDonald, Adam Fruehling, Ivan Kmecko, Lance Barron, Divyanshu Agrawal, Arthur M. Turner, John C. Ehmke, James C. Baker
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Patent number: 7480089Abstract: The disclosed embodiments combine an electrothermal actuator system with an electrostatic attraction system, in order to orient bistable micromirrors in digital micromirror devices (DMDs). The micromirror, pivotally supported, can switch between two orientations. While typical DMD systems use electrostatic electrodes to orient the micromirror, stiction forces can restrict micromirror motion, affecting optical performance. The disclosed embodiments use an electrothermal actuation system to mechanically assist the electrodes, overcoming stiction without the need for a high-voltage reset pulse.Type: GrantFiled: April 25, 2006Date of Patent: January 20, 2009Assignee: Texas Instruments IncorporatedInventor: Ivan Kmecko
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Patent number: 7402458Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.Type: GrantFiled: April 28, 2005Date of Patent: July 22, 2008Assignee: Texas Instruments IncorporatedInventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Faris
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Publication number: 20070247705Abstract: The disclosed embodiments combine an electrothermal actuator system with an electrostatic attraction system, in order to orient bistable micromirrors in digital micromirror devices (DMDs). The micromirror, pivotally supported, can switch between two orientations. While typical DMD systems use electrostatic electrodes to orient the micromirror, stiction forces can restrict micromirror motion, affecting optical performance. The disclosed embodiments use an electrothermal actuation system to mechanically assist the electrodes, overcoming stiction without the need for a high-voltage reset pulse.Type: ApplicationFiled: April 25, 2006Publication date: October 25, 2007Applicant: Texas Instruments IncorporatedInventor: Ivan Kmecko
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Publication number: 20050185252Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.Type: ApplicationFiled: April 28, 2005Publication date: August 25, 2005Inventors: Bradley Haskett, John O'Connor, Steven Smith, Mark Miller, Ivan Kmecko, Jwei Liu, Edward Fisher, Frank Armstrong, Daniel Estabrook, Jeffrey Faris
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Patent number: 6894853Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.Type: GrantFiled: May 10, 2002Date of Patent: May 17, 2005Assignee: Texas Instruments IncorporatedInventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Farris
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Publication number: 20030210452Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.Type: ApplicationFiled: May 10, 2002Publication date: November 13, 2003Applicant: Texas Instruments, Inc.Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Farris