Patents by Inventor Ivan Micallef

Ivan Micallef has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
    Publication number: 20220289560
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Application
    Filed: May 24, 2022
    Publication date: September 15, 2022
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor device and method of forming microelectromechanical systems (MEMS) package
    Patent number: 11370655
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: June 28, 2022
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
    Publication number: 20200399117
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Application
    Filed: March 20, 2020
    Publication date: December 24, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor device and method of forming microelectromechanical systems (MEMS) package
    Patent number: 10662056
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 26, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
    Publication number: 20190047845
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Application
    Filed: October 24, 2018
    Publication date: February 14, 2019
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor device and method of forming microelectromechanical systems (MEMS) package
    Patent number: 10189702
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: January 29, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
    Publication number: 20170297903
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Application
    Filed: November 28, 2016
    Publication date: October 19, 2017
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor device and method of forming microelectromechanical systems (MEMS) package
    Patent number: 9527723
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: December 27, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef
  • Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
    Publication number: 20150259194
    Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.
    Type: Application
    Filed: March 10, 2015
    Publication date: September 17, 2015
    Applicant: STATS ChipPAC, LTD.
    Inventors: Yaojian Lin, Won Kyoung Choi, Kang Chen, Ivan Micallef