Patents by Inventor Ivan Peytavin

Ivan Peytavin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9514403
    Abstract: The invention concerns a smart card comprising a card body provided with a cavity in which an electronic module incorporating a microelectronic chip is inserted, and at least one security marking designed to authenticate a component of the smart card. A first security marking is disposed on the microelectronic module, and a second security marking is disposed on the card body. The two security markings are linked by a visual identity or matching relationship indicating that the microelectronic module and the card body are original components assembled when the smart card was manufactured.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: December 6, 2016
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Philippe Lauri, Philippe Patrice, Ivan Peytavin
  • Publication number: 20150356400
    Abstract: The invention concerns a smart card comprising a card body provided with a cavity in which an electronic module incorporating a microelectronic chip is inserted, and at least one security marking designed to authenticate a component of the smart card. A first security marking is disposed on the microelectronic module, and a second security marking is disposed on the card body. The two security markings are linked by a visual identity or matching relationship indicating that the microelectronic module and the card body are original components assembled when the smart card was manufactured.
    Type: Application
    Filed: November 15, 2013
    Publication date: December 10, 2015
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Philippe LAURI, Philippe PATRICE, Ivan PEYTAVIN
  • Patent number: 7992790
    Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.
    Type: Grant
    Filed: February 3, 2006
    Date of Patent: August 9, 2011
    Assignee: Smart Packaging Solutions (SPS)
    Inventors: Olivier Brunet, Jean-Francois Salvo, Ivan Peytavin
  • Publication number: 20090219136
    Abstract: A secure document, in particular an electronic passport, includes a support equipped, on the one hand, with active security devices having a microcircuit connected to an antenna that can produce an electromagnetic response when it passes through the electromagnetic field of a contactless reader designed to query the identity document. The support is equipped, on the other hand, with passive security devices selected so as to have electrical characteristics, in particular inductive, capacitive and resistive, that are suitable for amplifying the electromagnetic response of the active security devices to make it go beyond a threshold that allows the secure document to be identified when it is placed in the electromagnetic field of a contactless reader. The invention has a useful application in national programs to issue passports with increased security.
    Type: Application
    Filed: August 3, 2006
    Publication date: September 3, 2009
    Inventors: Olivier Brunet, Olivier Artigue, Henri Boccia, Philippe Patrice, Ivan Peytavin
  • Publication number: 20090057414
    Abstract: A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.
    Type: Application
    Filed: February 3, 2006
    Publication date: March 5, 2009
    Applicant: SMART PACKAGING SOLUTIONS (SPS)
    Inventors: Olivier Brunet, Jean-Francois Salvo, Ivan Peytavin