Abstract: A reusable, high purity liquid chemical dispensing assembly is provided for use in a production line that processes chemically treated articles such as semiconductors. This dispensing assembly contains a high purity liquid chemical, such as photoresist, which it dispenses into a production line application station. The dispensing assembly can be disconnected from the production line when it is essentially emptied of the liquid chemical, and can be then rinsed and purged of chemical residue, and refilled with fresh chemical. The rinsing, purging, and refilling operations are performed in an environmentally safe manner. By providing a reusable dispensing assembly the problem of disposing of chemically polluted containers is eliminated.

Abstract: A process for applying a film of uniform thickness of photoresist solids onto a substrate comprising the steps of:(a) forming a liquid photoresist composition comprising photoresist solids in a solvent; the solids content of said photoresist composition being in the range from about 10% by weight to about 22% by weight;(b) forming atomized spray droplets of said liquid photoresist composition;(c) allowing said atomized spray droplets to settle by gravity onto a substrate surface, thereby forming a photoresist coating on that surface; and(d) spinning said coated substrate at a pre-determined spin speed and for a pre-determined time to remove substantially all of said solvent from said photoresist coating and to form a film of uniform thickness of photoresist solids on the substrate.