Patents by Inventor Ivan Salkovic

Ivan Salkovic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier comprising embedded magnet stack
    Patent number: 11889629
    Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: January 30, 2024
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Gerald Weidinger, Gerald Weis, Ivan Salkovic, Karl Kirchheimer
  • Component carrier with embedded magnetic inlay and integrated coil structure
    Patent number: 11792932
    Abstract: A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: October 17, 2023
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Ivan Salkovic, Gerald Weidinger, Johannes Stahr
  • Component Carrier With Embedded Magnetic Inlay and Integrated Coil Structure
    Publication number: 20230298804
    Abstract: A component carrier includes a stack with electrically conductive layer structures, at least one electrically insulating layer structure, and a magnetic inlay embedded in the stack. The electrically conductive layer structures form at least part of an electrically conductive coil structure surrounding at least part of the magnetic inlay. The coil structure includes at least one vertical segment with at least one plated slot filled with electrically conductive material.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Inventors: Ivan Salkovic, Gerald Weidinger, Johannes Stahr
  • Component Carrier With a Magnetic Element and a Manufacturing Method
    Publication number: 20220377896
    Abstract: A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 24, 2022
    Inventors: Ivan SALKOVIC, Vanesa LÓPEZ BLANCO
  • Magnetic Inlay With An Adjustable Inductance Value for a Component Carrier and a Manufacturing Method
    Publication number: 20220377895
    Abstract: A magnetic inlay for a component carrier includes a magnetic matrix and an electrically conductive structure embedded horizontally in the magnetic matrix. The electrically conductive structure is configured as an inductive element. The magnetic inlay is configured so that, depending on the geometrical properties of the electrically conductive structure, a specific inductance value is provided for the magnetic inlay.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 24, 2022
    Inventors: Gerald WEIDINGER, Ivan SALKOVIC, Markus KASTELIC
  • Magnetic Inlay With Electrically Conductive Vertical Through Connections for a Component Carrier
    Publication number: 20220377897
    Abstract: A magnetic inlay includes a magnetic matrix and a plurality of electrically conductive vertical through connections extending vertically through the magnetic matrix. Further, a component carrier including the magnetic inlay and a method of manufacturing said magnetic inlay are described.
    Type: Application
    Filed: May 16, 2022
    Publication date: November 24, 2022
    Inventors: Ivan SALKOVIC, Amin NICKKHOLGH
  • Substantially Annular Magnetic Member With Magnetic Particles in Non-Magnetic Matrix For Component Carrier
    Publication number: 20210241952
    Abstract: A magnetic member having a substantially annular structure includes a non-magnetic matrix and magnetic particles embedded in the matrix. The magnetic member may be arranged on or in a component carrier.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 5, 2021
    Inventors: Gerald Weidinger, Gerald Weis, Ivan Salkovic
  • Component Carrier With Embedded Magnetic Inlay and Integrated Coil Structure
    Publication number: 20210195749
    Abstract: A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 24, 2021
    Inventors: Ivan Salkovic, Gerald Weidinger, Johannes Stahr
  • Component Carrier Comprising Embedded Magnet Stack
    Publication number: 20200359503
    Abstract: A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.
    Type: Application
    Filed: April 28, 2020
    Publication date: November 12, 2020
    Inventors: Gerald Weidinger, Gerald Weiss, Ivan Salkovic, Karl Kirchheimer