Patents by Inventor Ivan Stone

Ivan Stone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMBINATION THERAPY USING A CD19-ADC AND VINCRISTINE
    Publication number: 20180028681
    Abstract: This invention relates to treatment of acute lymphoblastic leukemia.
    Type: Application
    Filed: February 12, 2016
    Publication date: February 1, 2018
    Applicant: SEATTLE GENETICS, INC.
    Inventors: Che-Leung Law, Ivan Stone
  • SEMICONDUCTOR WAFER FRONT SIDE PROTECTION
    Publication number: 20080064185
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Application
    Filed: October 29, 2007
    Publication date: March 13, 2008
    Applicant: International Business Machines Corporation
    Inventors: Allan Abrams, Donald Brouillette, Joseph Danaher, Timothy Krywanczyk, Rene Lamothe, Ivan Stone, Matthew Whalen
  • Semiconductor wafer front side protection
    Publication number: 20050202678
    Abstract: There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
    Type: Application
    Filed: April 28, 2005
    Publication date: September 15, 2005
    Applicant: International Business Machines Corporation
    Inventors: Allan Abrams, Donald Brouillette, Joseph Danaher, Timothy Krywanczyk, Rene Lamothe, Ivan Stone, Matthew Whalen