Abstract: A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint assembly. The method comprising heating the solder in the assembly to a temperature near the solvus.

Abstract: A system for reducing near-end crosstalk (NEXT) includes a first electrical component contributing to a first NEXT pulse of a first polarity and a second electrical component receiving the first NEXT pulse at a first time delay (td). A circuit couples the first electrical component to the second electrical component to create a second NEXT pulse of a second polarity and delays the second NEXT pulse by an amount equal to the first time delay (td). The first and second NEXT pulses are combined to reduce the first NEXT pulse. A method for reducing NEXT includes coupling a first component contributing to a first NEXT pulse of a first polarity and a second component to create a second NEXT pulse of a second polarity, delaying the second NEXT pulse, and combining the second NEXT pulse with the first NEXT pulse to reduce the first NEXT pulse.

Abstract: A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint assembly. The method comprising heating the solder in the assembly to a temperature near the solvus.

Abstract: A fluid cooled enclosure includes a fluid conduit that provides a fluid coolant path between sides of a housing. Optionally, the fluid conduit can provide bi-directional fluid coolant paths. In another example, an interface block can be provided with a first interface surface engaging an interface surface of a first end portion of the fluid conduit. In another example, a first end portion of the fluid conduit is fabricated with a first material composition and the interface block is fabricated with a second material composition that has a higher thermal conductivity than the first material composition. In further examples, methods of cooling a conduction cooled circuit module comprise the steps of mounting an interface block to a conduction cooled circuit module, mounting the interface block with respect to the fluid conduit, and cooling the electrical circuits of the conduction cooled circuit module by flowing fluid coolant through the fluid conduit.

Abstract: A circuit card apparatus includes a circuit card and a heat dissipation device in thermal contact with the circuit card at a thermal interface to conduct heat from the circuit card. An adjustable spacing element is adjustably coupled to one of the heat dissipation device and the circuit card. The adjustable spacing element is configured to be adjusted to set a minimum spaced distance between a portion of the circuit card and a portion of the heat dissipation device. A locking element is coupled to the adjustable spacing element to lock the minimum spaced distance. In further examples, methods of manufacturing a circuit card apparatus include the step of adjusting a spacing element to set the spaced distance as a minimum spaced distance between a portion of a heat dissipation device and a portion of a circuit card. The method further comprises the step of locking the minimum spaced distance.

Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.

Abstract: A fluid cooled enclosure includes a fluid conduit that provides a fluid coolant path between sides of a housing. Optionally, the fluid conduit can provide bi-directional fluid coolant paths. In another example, an interface block can be provided with a first interface surface engaging an interface surface of a first end portion of the fluid conduit. In another example, a first end portion of the fluid conduit is fabricated with a first material composition and the interface block is fabricated with a second material composition that has a higher thermal conductivity than the first material composition. In further examples, methods of cooling a conduction cooled circuit module comprise the steps of mounting an interface block to a conduction cooled circuit module, mounting the interface block with respect to the fluid conduit, and cooling the electrical circuits of the conduction cooled circuit module by flowing fluid coolant through the fluid conduit.

Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.

Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.

Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.

Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

Abstract: An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An example of the arrangement can include a source of pressurized coolant fluid connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device. In addition or alternatively, the arrangement can include a plurality of flexible conduits and an adjustment device adapted to selectively adjust he height of the cooling device. In addition or alternatively, a cooling apparatus within a cooling arrangement can comprise a cooling device, a coolant plate, and a coolant pathway including a first passage formed in the coolant plate and a second passage formed in the cooling device.

Abstract: An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An example of the arrangement can include a source of pressurized coolant fluid connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device. In addition or alternatively, the arrangement can include a plurality of flexible conduits and an adjustment device adapted to selectively adjust he height of the cooling device. In addition or alternatively, a cooling apparatus within a cooling arrangement can comprise a cooling device, a coolant plate, and a coolant pathway including a first passage formed in the coolant plate and a second passage formed in the cooling device.

Abstract: A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. The heat dissipation plate is held in thermal contact with the other side of the channel, providing a second additional heat path to channel heat away from individual components, the circuit card and/or the heat frame.

Abstract: One or more heat pipes are connected between a component on a circuit card and the frame of a circuit card assembly for transfer of heat to the frame of the circuit card assembly. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. Heat collector can be attached to the heat generating components of a circuit card between the heat pipe and the component to provide improved thermal transfer. A number of heat collectors with pairs of heat pipes extending in opposite directions from the collector to the frame can be used to allow the heat pipes to effectively dissipate heat form the circuit card assembly regardless of the orientation of the circuit card assembly.

Abstract: One or more heat pipes are connected between a component on a circuit card and the frame of a circuit card assembly for transfer of heat to the frame of the circuit card assembly. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. Heat collector can be attached to the heat generating components of a circuit card between the heat pipe and the component to provide improved thermal transfer. A number of heat collectors with pairs of heat pipes extending in opposite directions from the collector to the frame can be used to allow the heat pipes to effectively dissipate heat form the circuit card assembly regardless of the orientation of the circuit card assembly.