Abstract: A light-field optical image system with dual mode, having a main lens (103), a microlens array (102), an image sensor (101) and a first actuator (201) configured to cause a relative displacement between the image sensor (101) and the microlens array (102) to switch between at least two different optical configurations including: a light-field configuration, in which the image sensor (101) and the microlens array (102) are separated by a first distance (107a) that allows the image sensor (101) to capture a light-field image; and a 2D imaging configuration, in which the image sensor (101) and the microlens array (102) are separated by a second distance (107b), lower than the first distance (107a), that allows the image sensor (101) to avoid the light-field effect.

Abstract: An optical system (400) including a microlens array (104), an image sensor (108) and a PCB (206). The microlens array (104) is bonded to the image sensor (108) with glue lines (804) or glue drops (802) dispensed around the non-active area (404) of the microlens array (104). The image sensor (108) may be bonded to the PCB (206) with a layer of adhesive material (502) applied only on a central region of the image sensor (108). Alternatively, the image sensor can rest onto a thermally conductive resin layer (109) placed over a stiffener (207), and the image sensor can be attached to the PCB (206) by one or more glue drops (111) or glue lines (113) arranged on at least one side of the image sensor (108) or by an adhesive layer (115) laterally surrounding the image sensor (108). The optical system (400) solves the problem of misalignment between the image sensor and the microlens array caused by changes in temperature.

Abstract: An optical system (400) including a microlens array (104), an image sensor (108) and aPCB (206). The microlens array (104) is bonded to the image sensor (108) with glue lines (804) or glue drops (802) dispensed around the non-active area (404) of the microlens array (104). The image sensor (108) may be bonded to the PCB (206) with a layer of adhesive material (502) applied only on a central region of the image sensor (108). Alternatively, the image sensor can rest onto a thermally conductive resin layer (109) placed over a stiffener (207), and the image sensor can be attached to the PCB (206) by one or more glue drops (111) or glue lines (113) arranged on at least one side of the image sensor (108) or by an adhesive layer (115) laterally surrounding the image sensor (108). The optical system (400) solves the problem of misalignment between the image sensor and the microlens array caused by changes in temperature.

Abstract: A method for obtaining depth information from a scene is disclosed wherein the method has the steps of: a) acquiring a plurality of images of the scene by means of at least one camera during a time of shot wherein the plurality of images offer at least two different views of the scene; b) for each of the images of step a), simultaneously acquiring data about the position of the images referred to a six-axis reference system; c) selecting from the images of step b) at least two images; d) rectifying the images selected on step c) thereby generating a set of rectified images; and e) generating a depth map from the rectified images. Additionally devices for carrying out the method are disclosed.

Abstract: A method for obtaining depth information from a scene is disclosed wherein the method has the steps of: a) acquiring a plurality of images of the scene by means of at least one camera during a time of shot wherein the plurality of images offer at least two different views of the scene; b) for each of the images of step a), simultaneously acquiring data about the position of the images referred to a six-axis reference system; c) selecting from the images of step b) at least two images; d) rectifying the images selected on step c) thereby generating a set of rectified images; and e) generating a depth map from the rectified images. Additionally devices for carrying out the method are disclosed.